Methods of forming parts using laser machining

ABSTRACT

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

RELATED APPLICATIONS

This application claims benefit of U.S. Provisional Patent ApplicationNos. 62/058,075, filed Sep. 30, 2014 (P-US325-B-MF) and 62/002,099,filed May 22, 2014 (P-US325-A-MF). This application is acontinuation-in-part of U.S. patent application Ser. No. 14/660,903,filed Mar. 17, 2015 (P-US329-A-MF) which in turn claims benefit of U.S.Provisional Patent Application Nos. 62/058,086, filed Sep. 30, 2014(P-US322-D-MF); 62/002,104, filed May 22, 2014 (P-US322-C-MF); and61/954,507, filed Mar. 17, 2014 (P-US322-A-MF). This application is acontinuation-in-part of U.S. patent application Ser. No. 14/156,437 (asis the '903 application), filed Jan. 15, 2014 (P-US321-A-MF) which inturn claims benefit of U.S. Provisional Patent Application Nos.61/888,060, filed Oct. 8, 2013 (P-US308-C-MF); 61/807,816, filed Apr. 3,2013 (P-US308-B-MF); and 61/752,596, filed Jan. 15, 2013 (P-US308-A-MF).This application is a continuation-in-part of U.S. patent applicationSer. No. 14/333,476 (as is the '903 application), filed Jul. 16, 2014(P-US326-A-MF) which in turn claims benefit of U.S. Provisional PatentApplication No. 61/846,745, filed Jul. 16, 2013 (P-US314-A-MF). Theseapplications are incorporated herein by reference as if set forth infull herein.

FIELD OF THE INVENTION

The present invention relates generally to the field of formingmicrostructures or MEMS and in some embodiments to the field of formingmicro-scale or millimeter-scale probes or contactors for use inelectrical testing or interconnect applications such as wafer levelsemiconductor device testing and more particularly to processes forforming such structures or devices using laser machining methods.

Background of the Invention

Various methods for forming microprobes and other structures have beentaught previously. Some of these methods have involved multi-layer,multi-material electrodeposition (e.g. to produce microprobes). Examplesof such methods are set forth in US Patent Application Publication No.2011/0132767, by Ming Ting Wu et al., and entitled Multi-Layer,“Multi-Material Fabrication Methods for Producing Micro-Scale andMillimeter-Scale Devices with Enhanced Electrical or MechanicalProperties”.

Some of these methods have involved the use of laser cutting. Examplesof such methods are set forth in US Patent Application Publication No.2012/0286816, by January Kister and entitled “PROBES WITH HIGH CURRENTCARRYING CAPABILITY AND LASER MACHINING METHODS”. As exemplified, lasercutting is used to cut out cross-sections of probes from sheets ofmaterial such as tungsten, copper-tungsten mixtures, or molybdenum. Inthe processes, as taught, the sheet material is completely cut throughpreferably using a plurality of passes of the laser beam such that eachpass removes a fraction of the thickness of the sheet. During thecutting, the sheet is elevated above a base and once the sheet is cutall the way through individual probes fall away from the sheet. In someembodiments, tip ends and or opposite ends of the probes may be coatedwith appropriate materials. Such coatings may improve bonding, probeconductivity, and/or tip hardness.

Some prior approaches to laser cutting parts from a foil or sheet haveincluded methods of tethering parts (e.g. structures such as probes) tothe foil so that they are still minimally attached to the foil followingthe laser machining process. This modification poses challenges as itstill allows movement of the parts in areas that are not tethered, mayallow differential heating of various portions of the parts, andrequires removal of the tethers without damaging the parts which mayhave moved.

A need remains for improved methods for forming microprobes and othermicroscale or millimeter scale parts or structures and possiblemulti-component microscale or millimeter scale devices that includematerials that are not electrodepositable. A need remains for improvedmethods of forming microprobes and other microdevices using lasercutting. A need remains for improved methods of forming microdevices andimproved microdevices themselves that include both laser cut featuresand deposited materials.

SUMMARY OF THE INVENTION

It is an object of some embodiments of the invention to provide animproved method for forming multi-layer three-dimensional structureswith improved material properties, e.g. probes with improved propertiesthat can be used for testing integrated circuits.

It is an object of some embodiments of the invention to provide animproved method for forming single layer structures with improvedmaterial properties, e.g. probes with improved properties that can beused for testing integrated circuits.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, using lasermachining of sheet material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, from multiple bondedsheets of material using laser machining.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, formed from acombination of sheet material and deposited material wherein lasermachining is used to define the dimensions of the sheet material but isnot used to define the dimensions of the deposited material.

It is an object of some embodiments of the invention to provide animproved method for fabricating probes formed from a combination ofsheet material and deposited material wherein laser machining is used todefine the dimensions of the sheet material and part of the dimensionsof the deposited material or materials.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, from a combinationof sheet material and deposited material wherein the laser machining isused to define the dimensions of the sheet material and the dimensionsof the deposited material or materials.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, having a tipmaterial that is different from the sheet material wherein the tipmaterial is deposited on to the sheet material prior to patterning thesheet material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, having a tipmaterial that is different from the sheet material wherein the tipmaterial is deposited on to the sheet material after at least partialpatterning the sheet material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, having aconductivity enhancing material that is different from the sheetmaterial wherein the conductivity enhancing material is deposited on tothe sheet material prior to patterning the sheet material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, having aconductivity enhancing material that is different from the sheetmaterial wherein the conductivity enhancing material is deposited on tothe sheet material after at least partial patterning the sheet material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, having a bondingenhancement material that is different from the sheet material whereinthe bonding enhancement material is deposited on to the sheet materialprior to patterning the sheet material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, having a bondingenhancement material that is different from the sheet material whereinthe bonding enhancement material is deposited on to the sheet materialafter at least partial patterning the sheet material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, having a contact tiplocated in a common plane as the sheet material but formed of adifferent material. In some variations of this object, the tip and thesheet material of the probe may be held together not just by a bondingor joining of the material but by one or more of (1) a mechanicalinterlocking of the different materials within the plane of the sheet,(2) the tip material wrapping around at least part of one or bothopposing sides of the sheet material, (3) the tip material being held byone or more channels or holes in the sheet material that result in apartial surrounding of the tip material by the sheet material, and (4)by a sandwich of either additional sheet material or some other materialon at least one side but possibly on two opposing sides of at least aportion of the tip material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, having a part bodyformed from at least one sheet of material and a part tip which islocated on a layer different from a layer that includes the at least onesheet of material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, wherein the partsare formed at least in part from laser cutting of sheets of materialwhere the cutting of a portion of a periphery of one part by a laserbeam results in cutting the periphery of a portion of a neighboring partthat is being formed from the sheet or sheets.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, wherein the partsare formed at least in part from a sheet of material wherein thematerial of the sheet meets one or more of the following criteria: (1)the material is not electrodepositable from an aqueous solution, and (2)the material comprises a conductive refractory material.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, and handling partswherein a plurality of parts remain tethered to one another afterfabrication and removal of a bridging sacrificial material but which areuntethered prior to (1) assembly into an array or (2) after assembly butprior to being put to use.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, wherein a coating ofan additional structural material occurs in whole or in part afterremoval of a bridging material. In some variations, the parts aretethered together during the removal.

It is an object of some embodiments of the invention to provide animproved method for fabricating parts, e.g. probes, using laser cuttingof a sheet material wherein a laser beam is directed onto the sheet withan orientation selected from one or more of: (1) perpendicular to aninitial incident surface of the sheet, (2) at a non-perpendicular angleto an initial incident surface of the sheet, (3) at a non-perpendicularangle to and initial incident surface of the sheet wherein the anglevaries depending on the region of the part being cut.

It is an object of some embodiments of the invention to provide improvedmicro-scale or millimeter scale parts, e.g. probes.

It is an object of some embodiments of the invention to providemicro-scale or millimeter-scale parts, e.g. probe devices, incorporatingmultiple bonded sheets of material. In some variations of this object,the one or more sheets may be laser cut (e.g. to form openings) prior toor after bonding. In other variations, the sheets may be bonded withoutan intermediate bonding material. In still other variations the sheetsmay be bonded using one or more intermediate materials located betweenthe sheets.

It is an object of some embodiments of the invention to providemicro-scale or millimeter-scale parts, e.g. probe devices, incorporatinga combination of laser cut sheet material and deposited material (e.g.blanket deposited, lithographically patterned, or laser patterned).

It is an object of some embodiments of the invention to provide improvedmethods for fabricating micro-scale or millimeter parts, e.g. probes,having improved laser cut sidewall features.

It is an object of some embodiments of the invention to provide improvedmethods for fabricating micro-scale or millimeter parts, e.g. probes,using improved part stabilization during the entire laser cuttingprocess.

It is an object of some embodiments of the invention to provide improvedmethods for fabricating micro-scale or millimeter parts, e.g. probes,using improved protection against cutting debris accumulation on partsurfaces.

It is an object of some embodiments of the invention to provide improvedmethods for fabricating micro-scale or millimeter parts, e.g. probes,using improved temperature stabilization during laser cutting

It is an object of some embodiments of the invention to provide improvedmethods for fabricating micro-scale or millimeter-scale parts or devicesthat are not probes.

It is an object of some embodiments of the invention to provide improvedsidewall shapes (e.g. more vertical sidewalls, desired sidewall slope ortaper, minimization of edge roughness from either unintended removal ofmaterial or re-deposition of ablated material) that may result fromlaser machining.

It is an object of some embodiments of the invention to provide improvedlaser machining times while achieving desired or adequate side wallconfigurations.

It is an object of some embodiments of the invention to provide improvedlaser machining time and/or side wall shape achieved by laser machiningwhile cutting through a plurality of different materials.

Other objects and advantages of various embodiments of the inventionwill be apparent to those of skill in the art upon review of theteachings herein. The various embodiments of the invention, set forthexplicitly herein or otherwise ascertained from the teachings herein,may address one or more of the above objects alone or in combination, oralternatively may address some other object ascertained from theteachings herein. It is not intended that all objects be addressed byany single embodiment or aspect of the invention even though that may bethe case with regard to some embodiments and/or aspects. The inventionas claimed in any specific claim need not address the objects of theinvention as set forth above either alone or in combination though thatmay be the case for some claims.

In a first aspect of the invention a method of forming at least onemicro-scale or millimeter-scale structure, includes: (a) providing atleast one sheet of structural material having a front side and abackside; (b) locating a bridging sacrificial material directly orindirectly on the backside of the at least one sheet of structuralmaterial; (c) using a laser beam to cut completely through the at leastone sheet from the front side to the backside; and (d) removing thebridging sacrificial material.

Numerous variations of the first aspect of the invention exist andinclude, for example, one or more of: (1) the structural material of thesheet includes a metal; (2) the bridging sacrificial material includes ametal; (3) the bridging sacrificial material is deposited directly orindirectly onto the at least one sheet of structural material byelectroplating; (4) a sacrificial capping material is located directlyor indirectly on the opposite side of the at least one sheet structuralmaterial relative to the bridging sacrificial material: (5) the cappingsacrificial material of the 4^(th) variation can be a metal; (6) thecapping sacrificial material of the 4^(th) and 5^(th) variations can bedeposited directly or indirectly onto the at least one sheet ofstructural material by electroplating; (7) the bridging sacrificialmaterial is attached directly or indirectly to a base; (8) the base ofthe 7^(th) variation comprises a frame to which the bridging sacrificialmaterial is attached; (9) the attachment to the base of the 7^(th)variation can include a method selected from the group consisting of (a)locating a solidifiable polymer between the base and the bridgingsacrificial material and then solidifying the polymer, (b)electroplating a sacrificial material through openings in the base ontothe bridging sacrificial material that is being pressed against thebase; (10) the at least one structure is selected from the groupconsisting of (a) a compliant pin, (b) a probe for use in a probe cardfor testing integrated circuits, (c) an electrical spring contactor, and(d) a multi-component device; (11) cutting by the laser beam occurs by amethod selected from the group consisting of: (a) using a single passthat cuts completely through the sheet material, (b) using multiplepasses along a common cutting line, and (c) using multiple passes alonga plurality of offset cutting lines; (12) the direct or indirectlocating of the bridging sacrificial material on the sheet of structuralmaterial comprises indirect locating as at least one intermediatematerial is positioned between the bridging sacrificial material and thesheet of structural material wherein the at least one material isselected from the group consisting of (a) one single material layer, (b)a plurality of single material layers, (c) a single multi-materiallayer, (d) a plurality of multi-material layers, (e) a combination of atleast one multi-material layer and at least one single material layer;(13) the direct or indirect locating of the capping sacrificial materialon the sheet of structural material of the 4^(th)-7^(th) variationincludes indirect locating as at least one intermediate material ispositioned between the capping sacrificial material and the sheet ofstructural material wherein the at least one material is selected fromthe group consisting of (a) one single material layer, (b) a pluralityof single material layers, (c) a single multi-material layer, (d) aplurality of multi-material layers, (e) a combination of at least onemulti-material layer and at least one single material layer; (13) theangle of incidence of a laser beam onto the sheet material is differentwhen cutting at least two different portions of the sheet material; (14)the at least one structure formed is inspected and wherein at least onestep is implemented that is selected from the group consisting of: (a)flagging any failed structure for special handling; (b) cutting anyfailed structure into two or more pieces to enable them to be readilydistinguished from structures that did not fail inspection; (c)attaching any failed structure to adjacent element; (15) use of at leastone planarization operation of to set a boundary level for at least oneof the layers; (16) the at least one structure includes a plurality ofidentical structures; (17) the at least one structure includes aplurality of structures with at least two of the plurality havingdifferent configurations; (18) the at least one sheet material includesat least one region that undergoes vertical narrowing by laser ablationprior to cutting out the perimeter region of the at least one structure;(18) the at least one sheet material includes at least one region thatundergoes vertical narrowing by laser ablation after cutting out theperimeter region of the at least one structure; (19) the at least onesheet material includes at least one region that undergoes verticalnarrowing prior to locating at least one additional layer of material;(20) the at least one sheet material undergoes laser ablation to form atleast one through hole prior to locating at least one additional layerof material; (21) during laser cutting the sacrificial bridging materialis cut completely through in at least some locations; (22) during lasercutting the sacrificial bridging material is not cut completely throughin any locations; (23) laser cutting of the sheet material or of anotherstructural material occurs from both the top and bottom surfaces. Thesevariations may be used as variations of other variations so long as theadded variation makes sense and so long as not all benefits of the addedvariation are eliminated by the combination.

In a second aspect of the invention, a method of forming at least onemicro-scale or millimeter-scale structure, includes: (a) providing atleast one sheet of structural material having a front side and abackside; (b) locating a bridging sacrificial material directly orindirectly on the backside of the at least one sheet of structuralmaterial; (c) using a laser beam to cut completely through the at leastone sheet from the front side to the backside but not completely throughthe bridging sacrificial material such that during the cutting thestructural material of the at least one sheet on either side of a cutretains its relative position; and (d) removing the bridging sacrificialmaterial.

Numerous variations of the second aspect of the invention exist andinclude, for example: (1) the structural material of the sheet includesa metal; (2) the bridging sacrificial material includes a metal; (3) thebridging sacrificial material is deposited directly or indirectly ontothe at least one sheet of structural material by electroplating; (4) asacrificial capping material is located directly or indirectly on theopposite side of the at least one sheet structural material relative tothe bridging sacrificial material: (5) the capping sacrificial materialof the 4^(th) variation can be a metal; (6) the capping sacrificialmaterial of the 4^(th) and 5^(th) variations can be deposited directlyor indirectly onto the at least one sheet of structural material byelectroplating; (7) the bridging sacrificial material is attacheddirectly or indirectly to a base; (8) the base of the 7^(th) variationcomprises a frame to which the bridging sacrificial material isattached; (9) the attachment to the base of the 7^(th) variation caninclude a method selected from the group consisting of (a) locating asolidifiable polymer between the base and the bridging sacrificialmaterial and then solidifying the polymer, (b) electroplating asacrificial material through openings in the base onto the bridgingsacrificial material that is being pressed against the base; (10) the atleast one structure is selected from the group consisting of (a) acompliant pin, (b) a probe for use in a probe card for testingintegrated circuits, (c) an electrical spring contactor, and (d) amulti-component device; (11) cutting by the laser beam occurs by amethod selected from the group consisting of: (a) using a single passthat cuts completely through the sheet material, (b) using multiplepasses along a common cutting line, and (c) using multiple passes alonga plurality of offset cutting lines; (12) the direct or indirectlocating of the bridging sacrificial material on the sheet of structuralmaterial comprises indirect locating as at least one intermediatematerial is positioned between the bridging sacrificial material and thesheet of structural material wherein the at least one material isselected from the group consisting of (a) one single material layer, (b)a plurality of single material layers, (c) a single multi-materiallayer, (d) a plurality of multi-material layers, (e) a combination of atleast one multi-material layer and at least one single material layer;(13) the direct or indirect locating of the capping sacrificial materialon the sheet of structural material of the 4^(th)-7^(th) variationincludes indirect locating as at least one intermediate material ispositioned between the capping sacrificial material and the sheet ofstructural material wherein the at least one material is selected fromthe group consisting of (a) one single material layer, (b) a pluralityof single material layers, (c) a single multi-material layer, (d) aplurality of multi-material layers, (e) a combination of at least onemulti-material layer and at least one single material layer; (13) theangle of incidence of a laser beam onto the sheet material is differentwhen cutting at least two different portions of the sheet material; (14)the at least one structure formed is inspected and wherein at least onestep is implemented that is selected from the group consisting of: (a)flagging any failed structure for special handling; (b) cutting anyfailed structure into two or more pieces to enable them to be readilydistinguished from structures that did not fail inspection; (c)attaching any failed structure to adjacent element; (15) use of at leastone planarization operation of to set a boundary level for at least oneof the layers; (16) the at least one structure includes a plurality ofidentical structures; (17) the at least one structure includes aplurality of structures with at least two of the plurality havingdifferent configurations; (18) the at least one sheet material includesat least one region that undergoes vertical narrowing by laser ablationprior to cutting out the perimeter region of the at least one structure;(19) the at least one sheet material includes at least one region thatundergoes vertical narrowing by laser ablation after cutting out theperimeter region of the at least one structure; (20) the at least onesheet material includes at least one region that undergoes verticalnarrowing prior to locating at least one additional layer of material;and (21) the at least one sheet material undergoes laser ablation toform at least one through hole prior to locating at least one additionallayer of material. These variations may be used as variations of othervariations so long as the added variation makes sense and so long as notall benefits of the added variation are eliminated by the combination.

In a third aspect of the invention, a method of forming at least onemicro-scale or millimeter-scale structure, includes: (a) providing atleast one sheet of structural material having a front side and abackside; (b) locating bridging sacrificial material directly orindirectly on the backside of the at least one sheet of structuralmaterial; (c) locating the bridging sacrificial material directly orindirectly on a base, wherein the sheet of structural material and thebase are located on opposite sides of the bridging sacrificial material;(d) using a laser beam to cut completely through the at least one sheetand the bridging sacrificial material from the front side to thebackside to define a perimeter of the structure; and (e) removing thebridging sacrificial material to separate the structure from the base.

Numerous variations of the third aspect of the invention exist andinclude, for example: (1) the structural material of the sheet includesa metal; (2) the bridging sacrificial material includes a metal; (3) thebridging sacrificial material is deposited directly or indirectly ontothe at least one sheet of structural material by electroplating; (4) asacrificial capping material is located directly or indirectly on theopposite side of the at least one sheet structural material relative tothe bridging sacrificial material: (5) the capping sacrificial materialof the 4^(th) variation can be a metal; (6) the capping sacrificialmaterial of the 4^(th) and 5^(th) variations can be deposited directlyor indirectly onto the at least one sheet of structural material byelectroplating; (7) the attachment to the base includes a methodselected from the group consisting of (a) locating a solidifiablepolymer between the base and the bridging sacrificial material and thensolidifying the polymer, (b) electroplating a sacrificial materialthrough openings in the base onto the bridging sacrificial material thatis being pressed against the base; (8) the at least one structure isselected from the group consisting of (a) a compliant pin, (b) a probefor use in a probe card for testing integrated circuits, (c) anelectrical spring contactor, and (d) a multi-component device; (9)cutting by the laser beam occurs by a method selected from the groupconsisting of: (a) using a single pass that cuts completely through thesheet material, (b) using multiple passes along a common cutting line,and (c) using multiple passes along a plurality of offset cutting lines;(10) the direct or indirect locating of the bridging sacrificialmaterial on the sheet of structural material comprises indirect locatingas at least one intermediate material is positioned between the bridgingsacrificial material and the sheet of structural material wherein the atleast one material is selected from the group consisting of (a) onesingle material layer, (b) a plurality of single material layers, (c) asingle multi-material layer, (d) a plurality of multi-material layers,(e) a combination of at least one multi-material layer and at least onesingle material layer; (11) the direct or indirect locating of thecapping sacrificial material on the sheet of structural material of the4^(th)-7^(th) variation includes indirect locating as at least oneintermediate material is positioned between the capping sacrificialmaterial and the sheet of structural material wherein the at least onematerial is selected from the group consisting of (a) one singlematerial layer, (b) a plurality of single material layers, (c) a singlemulti-material layer, (d) a plurality of multi-material layers, (e) acombination of at least one multi-material layer and at least one singlematerial layer; (12) the angle of incidence of a laser beam onto thesheet material is different when cutting at least two different portionsof the sheet material; (14) the at least one structure formed isinspected and wherein at least one step is implemented that is selectedfrom the group consisting of: (a) flagging any failed structure forspecial handling; (b) cutting any failed structure into two or morepieces to enable them to be readily distinguished from structures thatdid not fail inspection; (c) attaching any failed structure to adjacentelement; (13) use of at least one planarization operation of to set aboundary level for at least one of the layers; (14) the at least onestructure includes a plurality of identical structures; (15) the atleast one structure includes a plurality of structures with at least twoof the plurality having different configurations; (16) the at least onesheet material includes at least one region that undergoes verticalnarrowing by laser ablation prior to cutting out the perimeter region ofthe at least one structure; (17) the at least one sheet materialincludes at least one region that undergoes vertical narrowing by laserablation after cutting out the perimeter region of the at least onestructure; (18) the at least one sheet material includes at least oneregion that undergoes vertical narrowing prior to locating at least oneadditional layer of material; and (19) the at least one sheet materialundergoes laser ablation to form at least one through hole prior tolocating at least one additional layer of material. These variations maybe used as variations of other variations so long as the added variationmakes sense and so long as not all benefits of the added variation areeliminated by the combination.

In a fourth aspect of the invention a method of forming at least onemicro-scale or millimeter-scale structure, includes: (a) providing atleast one sheet of structural material having a front side and abackside; (b) locating bridging sacrificial material directly orindirectly on the backside of the at least one sheet of structuralmaterial; (c) using a laser beam to cut completely through the at leastone sheet of structural material along a perimeter of the structureexcept at at least one location such that a tethering element is formedof a portion of the at least one sheet material that continues toconnect the sheet structural material on either side of an openingthrough the at least one sheet of structural material cut by the laserbeam; and (d) removing the bridging sacrificial material and cutting thetethering element to separate the structure from the substrate and toseparate the structure from other structural material of the at leastone sheet.

Numerous variations of the forth aspect of the invention exist andinclude, for example: (1) the structural material of the sheet includesa metal; (2) the bridging sacrificial material includes a metal; (3) thebridging sacrificial material is deposited directly or indirectly ontothe at least one sheet of structural material by electroplating; (4) asacrificial capping material is located directly or indirectly on theopposite side of the at least one sheet structural material relative tothe bridging sacrificial material: (5) the capping sacrificial materialof the 4^(th) variation can be a metal; (6) the capping sacrificialmaterial of the 4^(th) and 5^(th) variations can be deposited directlyor indirectly onto the at least one sheet of structural material byelectroplating; (7) the bridging sacrificial material is attacheddirectly or indirectly to a base; (8) the base of the 7^(th) variationcomprises a frame to which the bridging sacrificial material isattached; (9) the attachment to the base of the 7^(th) variation caninclude a method selected from the group consisting of (a) locating asolidifiable polymer between the base and the bridging sacrificialmaterial and then solidifying the polymer, (b) electroplating asacrificial material through openings in the base onto the bridgingsacrificial material that is being pressed against the base; (10) the atleast one structure is selected from the group consisting of (a) acompliant pin, (b) a probe for use in a probe card for testingintegrated circuits, (c) an electrical spring contactor, and (d) amulti-component device; (11) cutting by the laser beam occurs by amethod selected from the group consisting of: (a) using a single passthat cuts completely through the sheet material, (b) using multiplepasses along a common cutting line, and (c) using multiple passes alonga plurality of offset cutting lines; (12) the direct or indirectlocating of the bridging sacrificial material on the sheet of structuralmaterial comprises indirect locating as at least one intermediatematerial is positioned between the bridging sacrificial material and thesheet of structural material wherein the at least one material isselected from the group consisting of (a) one single material layer, (b)a plurality of single material layers, (c) a single multi-materiallayer, (d) a plurality of multi-material layers, (e) a combination of atleast one multi-material layer and at least one single material layer;(13) the direct or indirect locating of the capping sacrificial materialon the sheet of structural material of the 4^(th)-7^(th) variationincludes indirect locating as at least one intermediate material ispositioned between the capping sacrificial material and the sheet ofstructural material wherein the at least one material is selected fromthe group consisting of (a) one single material layer, (b) a pluralityof single material layers, (c) a single multi-material layer, (d) aplurality of multi-material layers, (e) a combination of at least onemulti-material layer and at least one single material layer; (13) theangle of incidence of a laser beam onto the sheet material is differentwhen cutting at least two different portions of the sheet material; (14)the at least one structure formed is inspected and wherein at least onestep is implemented that is selected from the group consisting of: (a)flagging any failed structure for special handling; (b) cutting anyfailed structure into two or more pieces to enable them to be readilydistinguished from structures that did not fail inspection; (c)attaching any failed structure to adjacent element; (15) use of at leastone planarization operation of to set a boundary level for at least oneof the layers; (16) the at least one structure includes a plurality ofidentical structures; (17) the at least one structure includes aplurality of structures with at least two of the plurality havingdifferent configurations; (18) the at least one sheet material includesat least one region that undergoes vertical narrowing by laser ablationprior to cutting out the perimeter region of the at least one structure;(18) the at least one sheet material includes at least one region thatundergoes vertical narrowing by laser ablation after cutting out theperimeter region of the at least one structure; (19) the at least onesheet material includes at least one region that undergoes verticalnarrowing prior to locating at least one additional layer of material;(20) the at least one sheet material undergoes laser ablation to form atleast one through hole prior to locating at least one additional layerof material; (21) during laser cutting the sacrificial bridging materialis cut completely through in at least some locations; (22) during lasercutting the sacrificial bridging material is not cut completely throughin any locations; (23) laser cutting of the sheet material or of anotherstructural material occurs from both the top and bottom surfaces; (24)the using of a laser beam to cut completely through the at least onesheet of structural material along a perimeter of the structure exceptat at least one location comprises leaving at least two separatedregions uncut such that at least two tethering elements are formed; (25)the removing of the bridging sacrificial material occurs prior to thecutting of the tethering element or elements; (26) the removing thebridging sacrificial material occurs after the cutting of the tetheringelement or elements; (27) the at least one structure includes aplurality of structures and wherein an order of cutting tethers andremoving bridging sacrificial material is selected from the groupconsisting of: (a) each tethering element for structures that did notfail in fabrication are cut prior to removing the bridging sacrificialmaterial whereas at least one tethering element for each of anystructures that failed in fabrication are not cut prior to removing thebridging sacrificial material and (b) each tethering element for anystructures that failed fabrication process are cut prior to removing thebridging sacrificial material whereas at least one tethering element foreach structure that did not fail fabrication are not cut prior toremoving the bridging sacrificial material; (28) after removal of thebridging sacrificial material of but prior to cutting at least some ofthe tethering elements, applying one or more coatings of at least onestructural material to at least a portion of the at least one structure.These variations may be used as variations of other variations so longas the added variation makes sense and so long as not all benefits ofthe added variation are eliminated by the combination.

In a fifth aspect of the invention, a method of forming at least onemicro-scale or millimeter-scale structure, includes: (a) providing atleast one sheet of structural material having a front side and abackside; (b) locating bridging sacrificial material directly orindirectly on the backside of the at least one sheet of structuralmaterial; (c) using a laser beam to cut completely through the at leastone sheet of structural material along a perimeter of the structure; (d)locating at least one deposited single structural material layer ormulti-material layer directly or indirectly in contact with the at leastone sheet of structural material, wherein the at least one depositedsingle structural material layer or multi-material layer provides atleast one tethering element of structural material that connects thesheet structural material on either side of an opening through the atleast one sheet of structural material cut by the laser beam; and (e)removing the bridging sacrificial material and cutting the at least onetethering element to separate the structure from the substrate and toseparate the structure from other structural material of the at leastone sheet.

Numerous variations of the fifth aspect of the invention exist andinclude, for example: (1) the structural material of the sheet includesa metal; (2) the bridging sacrificial material includes a metal; (3) thebridging sacrificial material is deposited directly or indirectly ontothe at least one sheet of structural material by electroplating; (4) asacrificial capping material is located directly or indirectly on theopposite side of the at least one sheet structural material relative tothe bridging sacrificial material: (5) the capping sacrificial materialof the 4^(th) variation can be a metal; (6) the capping sacrificialmaterial of the 4^(th) and 5^(th) variations can be deposited directlyor indirectly onto the at least one sheet of structural material byelectroplating; (7) the bridging sacrificial material is attacheddirectly or indirectly to a base; (8) the base of the 7^(th) variationcomprises a frame to which the bridging sacrificial material isattached; (9) the attachment to the base of the 7^(th) variation caninclude a method selected from the group consisting of (a) locating asolidifiable polymer between the base and the bridging sacrificialmaterial and then solidifying the polymer, (b) electroplating asacrificial material through openings in the base onto the bridgingsacrificial material that is being pressed against the base; (10) the atleast one structure is selected from the group consisting of (a) acompliant pin, (b) a probe for use in a probe card for testingintegrated circuits, (c) an electrical spring contactor, and (d) amulti-component device; (11) cutting by the laser beam occurs by amethod selected from the group consisting of: (a) using a single passthat cuts completely through the sheet material, (b) using multiplepasses along a common cutting line, and (c) using multiple passes alonga plurality of offset cutting lines; (12) the direct or indirectlocating of the bridging sacrificial material on the sheet of structuralmaterial comprises indirect locating as at least one intermediatematerial is positioned between the bridging sacrificial material and thesheet of structural material wherein the at least one material isselected from the group consisting of (a) one single material layer, (b)a plurality of single material layers, (c) a single multi-materiallayer, (d) a plurality of multi-material layers, (e) a combination of atleast one multi-material layer and at least one single material layer;(13) the direct or indirect locating of the capping sacrificial materialon the sheet of structural material of the 4^(th)-7^(th) variationincludes indirect locating as at least one intermediate material ispositioned between the capping sacrificial material and the sheet ofstructural material wherein the at least one material is selected fromthe group consisting of (a) one single material layer, (b) a pluralityof single material layers, (c) a single multi-material layer, (d) aplurality of multi-material layers, (e) a combination of at least onemulti-material layer and at least one single material layer; (13) theangle of incidence of a laser beam onto the sheet material is differentwhen cutting at least two different portions of the sheet material; (14)the at least one structure formed is inspected and wherein at least onestep is implemented that is selected from the group consisting of: (a)flagging any failed structure for special handling; (b) cutting anyfailed structure into two or more pieces to enable them to be readilydistinguished from structures that did not fail inspection; (c)attaching any failed structure to adjacent element; (15) use of at leastone planarization operation of to set a boundary level for at least oneof the layers; (16) the at least one structure includes a plurality ofidentical structures; (17) the at least one structure includes aplurality of structures with at least two of the plurality havingdifferent configurations; (18) the at least one sheet material includesat least one region that undergoes vertical narrowing by laser ablationprior to cutting out the perimeter region of the at least one structure;(18) the at least one sheet material includes at least one region thatundergoes vertical narrowing by laser ablation after cutting out theperimeter region of the at least one structure; (19) the at least onesheet material includes at least one region that undergoes verticalnarrowing prior to locating at least one additional layer of material;(20) the at least one sheet material undergoes laser ablation to form atleast one through hole prior to locating at least one additional layerof material; (21) during laser cutting the sacrificial bridging materialis cut completely through in at least some locations; (22) during lasercutting the sacrificial bridging material is not cut completely throughin any locations; (23) laser cutting of the sheet material or of anotherstructural material occurs from both the top and bottom surfaces; (24)the at least one tethering element includes at least two tetheringelements for a single structure; (25) the removing of the bridgingsacrificial material occurs prior to the cutting of the tetheringelement or elements; (26) the removing the bridging sacrificial materialoccurs after the cutting of the tethering element or elements; (27) theat least one structure includes a plurality of structures and wherein anorder of cutting tethers and removing bridging sacrificial material isselected from the group consisting of: (a) each tethering element forstructures that did not fail in fabrication are cut prior to removingthe bridging sacrificial material whereas at least one tethering elementfor each of any structures that failed in fabrication are not cut priorto removing the bridging sacrificial material and (b) each tetheringelement for any structures that failed fabrication process are cut priorto removing the bridging sacrificial material whereas at least onetethering element for each structure that did not fail fabrication arenot cut prior to removing the bridging sacrificial material; and (28)after removal of the bridging sacrificial material but prior to cuttingat least some of the tethering elements, applying one or more coatingsof at least one structural material to at least a portion of the atleast one structure. These variations may be used as variations of othervariations so long as the added variation makes sense and so long as notall benefits of the added variation are eliminated by the combination.

In a sixth aspect of the invention a method of forming at least onemicro-scale or millimeter-scale structure, includes (a) providing atleast one sheet of structural material having a front side and abackside; (b) locating at least one multi-material layer comprising astructural material in some lateral regions and a sacrificial materialin other lateral regions of the multi-material layer indirectly ordirectly to the backside of the at least one sheet of structuralmaterial; (c) using a laser beam to cut completely through the at leastone sheet from the front side to the back side but not completelythrough the at least one multi-material layer such that during thecutting the structural material from the at least one sheet on eitherside of a cut retains its position relative to another side of the cut;and (d) removing the sacrificial material from the at least onemulti-material layer.

Numerous variations of the sixth aspect of the invention exist andinclude, for example: (1) the structural material of the sheet includesa metal; (2) a sacrificial capping material is located directly orindirectly on the opposite side of the at least one sheet structuralmaterial relative to the bridging sacrificial material; (3) the cappingsacrificial material of the second variation includes a metal; (4) thecapping sacrificial material of the third variation is depositeddirectly or indirectly onto the at least one sheet of structuralmaterial by electroplating; (5) the at least one multi-material layer isattached directly or indirectly to a base; (6) the base of the fifthvariation includes a frame to which attachment is made; (7) theattachment to the base of the fifth variation includes a method selectedfrom the group consisting of (a) locating a solidifiable polymer betweenthe base and the at least one multi-material layer and then solidifyingthe polymer, (b) electroplating a sacrificial material through openingsin the base onto at least one multi-material layer that is being pressedagainst the base; (8) the at least one structure is selected from thegroup consisting of (a) a compliant pin, (b) a probe for use in a probecard for testing integrated circuits, (c) an electrical springcontactor, and (d) a multi-component device; (9) cutting by the laserbeam occurs by a method selected from the group consisting of: (a) usinga single pass that cuts completely through the sheet material, (b) usingmultiple passes along a common cutting line, and (c) using multiplepasses along a plurality of offset cutting lines; (10) the direct orindirect locating of the capping sacrificial material on the sheet ofstructural material of the second to fourth variations includes indirectlocating as at least one intermediate material is positioned between thecapping sacrificial material and the sheet of structural materialwherein the at least one material is selected from the group consistingof (a) one single material layer, (b) a plurality of single materiallayers, (3) a single multi-material layer, (d) a plurality ofmulti-material layers, (e) a combination of at least one multi-materiallayer and at least one single material layer; (11) the angle ofincidence of a laser beam onto the sheet material is different whencutting at least two different portions of the sheet material; (12) theat least one structure formed is inspected and wherein at least one stepis implement that is selected from the group consisting of (a) flaggingany failed structure for special handling, (b) cutting any failedstructure into two or more pieces to enable them to be readilydistinguished from structures that did not fail inspection, (c)attaching any failed structure to adjacent element; (13) at least oneplanarization operation is used to set a boundary level for at least oneof the layers; (14) the at least one structure comprises a plurality ofidentical structures; (15) the at least one structure comprises aplurality of structures with at least two of the plurality havingdifferent configurations; (16) the at least one sheet material includesat least one region that undergoes vertical narrowing by laser ablationprior to cutting out the perimeter region of the at least one structure;(17) the at least one sheet material includes at least one region thatundergoes vertical narrowing prior to locating at least one additionallayer of material; (18) the at least one sheet material undergoes laserablation to form at least one through hole prior to locating at leastone additional layer of material; and (19) laser cutting of the sheetmaterial or of another structural material occurs from both the top andbottom surfaces.

In a seventh aspect of the invention a method of forming at least onemicro-scale or millimeter-scale structure, includes: (a) providing atleast one sheet of structural material having a front side and abackside; (b) using a laser beam to cut at least one opening completelythrough the at least one sheet from the front side to the back side inone or more regions to define at least one sheet material end of astructure to be formed; (c) depositing at least one single materiallayer or multi-material layer directly or indirectly onto at least aportion of both sides of the at least one sheet material such the atleast one single material not only is located on at least selectedlocations on both sides of the at least one sheet material but alsooccupies at least a portion of a side wall of the at least one openingin the at least one sheet material; (d) locating a sacrificial materialonto any exposed surface of the at least one single material layer ormulti-material layer or onto a material that was previously depositedthereon; (e) using a laser beam to cut completely through the at leastone sheet of structural material, the at least one single material ormulti-material layer, and completely through the sacrificial materiallocated on at least a front side of the at least one sheet of structuralmaterial and at least partially through the sacrificial material locatedon the back side of the at least one sheet of structural material; (f)removing the sacrificial material from the at least one single materiallayer or multi-material layer and from the at least one sheet ofstructural material, such that the structure is formed from a portion ofthe at least one sheet structural material and the at least a portion ofthe one single material layer or multi-material layers and wherein theat least one single material layer or multi-material layer defines adistal end of the structure or is located between a distal end of thestructure and a distal end of the at least one sheet of structuralmaterial that forms part of the structure.

Numerous variations of the seventh aspect of the invention are possible.Some such variations may be understood from the variations of the otheraspects of the invention and from variations set forth in other parts ofthis specification. Variations set forth with regard to other aspectscan be applied to this aspect so long as the variation makes sense inthe context of the seventh aspect and so long as it retains at leastsome benefit.

In an eighth aspect of the invention, a method of forming a plurality ofstructures, includes: (a) providing at least one structural materialcomprising a sheet; and (b) using a laser beam to cut completely throughthe structural material using a plurality of cutting paths around eachof the plurality of structures wherein each of the plurality of cuttingpaths are offset from a boundary of a respective structure and whereinat least two of the plurality of cutting paths have different offsets,at least one of the at least two cutting paths is scanned by the laserbeam at least once and another of the at least two cutting paths isscanned a plurality of times, and wherein the number of scans along eachof the at least two of the plurality of cutting paths is different.

In a ninth aspect of the invention, a batch method of forming at leastone structure, includes: (a) providing at least one structural materialcomprising a sheet; and (b) using a laser beam to cut completely throughthe structural material using a plurality of cutting paths that areoffset from a boundary of the at least one structure and wherein atleast two of the cutting paths have different offsets, at least one ofthe at least two cutting paths is scanned by the laser beam at leastonce and another of the at least two cutting paths is scanned aplurality of times, and wherein the number of scans along each of the atleast two cutting paths is different.

Numerous variations of the eighth and ninth aspects of the inventionexist and include, for example, one or more of: (1) greater energy isdelivered along the path closer to the boundary in part by use of agreater number of passes to expose that path than the other path that isfurther from the boundary; (2) the at least one sheet including at leasttwo sheets of different materials; (3) the at structure or plurality ofstructures each including a plurality of components each having aboundary; (4) the variation of (3) wherein the plurality of componentsinclude at least two components that are movable with respect to oneanother; (5) in addition to the at least one sheet, at least onedeposited layer of material that the laser cuts through; (6) thevariation of (5) wherein at least one deposited layer includes amulti-material layer with different materials located in differentlateral regions of the layer; (7) prior to laser cutting locating abridging sacrificial material on a backside of material that will formpart of the structure or structures; (8) prior to laser cutting locatinga capping sacrificial material on a front side of material that willform part of the structure; (9) the at least two of the plurality ofcutting paths that have different offsets comprises at least threepasses each; and/or (10) one or more of the variations noted inassociation with other aspects of the invention so long as suchvariations bring advantage.

In a tenth aspect of the invention, a method of forming at least onestructure, includes: (a) providing at least one structural materialcomprising a sheet material; and (b) using a laser beam to cutcompletely through the structural material using a plurality of cuttingpaths that are offset from a boundary of the at least one structure andwherein at least two of the cutting paths for the at least one structurehave different offsets, wherein the resulting cutting depth from theplurality of cutting paths for the at least one structure result in adifferential cutting depth which is deeper near the boundary andshallower at at least some locations further removed from the boundary.

In an eleventh aspect of the invention, a batch method of forming aplurality of structures, includes: (a) providing at least one structuralmaterial comprising a sheet material; and (b) using a laser beam to cutcompletely through the structural material using a plurality of cuttingpaths that are offset from a boundary of each of the plurality ofstructures wherein the at least two cutting paths for each structurehave different offsets relative to the boundary of the structure,wherein the resulting cutting depth from the plurality of cutting pathsfor each structure result in a differential cutting depth which isdeeper near the boundary and shallower at at least some locationsfurther removed from the boundary.

Numerous variations of the tenth and eleventh aspects of the inventionexist and include, for example, one or more of: (1) greater energy isdelivered along the path closer to the boundary in part by use of agreater number of passes to expose that path than the other path that isfurther from the boundary; (2) the at least one sheet including at leasttwo sheets of different materials; (3) the at structure or plurality ofstructures each including a plurality of components each having aboundary; (4) the variation of (3) wherein the plurality of componentsinclude at least two components that are movable with respect to oneanother; (5) in addition to the at least one sheet, at least onedeposited layer of material that the laser cuts through; (6) thevariation of (5) wherein at least one deposited layer includes amulti-material layer with different materials located in differentlateral regions of the layer; (7) prior to laser cutting locating abridging sacrificial material on a backside of material that will formpart of the structure or structures; (8) prior to laser cutting locatinga capping sacrificial material on a front side of material that willform part of the structure; and/or (9) one or more of the variationsnoted in association with other aspects of the invention so long as suchvariations bring advantage.

In a twelfth aspect of the invention, a method of forming at least onestructure, includes: (a) providing at least one structural materialcomprising a sheet; (b) cutting into the at least one structuralmaterial using a laser beam that scans a first offset path relative to aboundary of the at least one structure to cut into the structuralmaterial to a depth that is less than a thickness of the at least onestructural material: (c) cutting into the at least one structuralmaterial using the laser beam along a second offset path that is fartherfrom the boundary than the first offset path; (d) cutting into the atleast one structural material using the laser beam along a third offsetpath that is farther from the boundary than the second offset path; and(e) repeating the cutting of (b), (c), and (d) a plurality of times tocut completely through the thickness of the at least one structuralmaterial along the first offset path, wherein the energy delivered alongthe first path is greater than the energy delivered along the secondpath which is greater than the energy delivered along the third path.

In a thirteenth aspect of the invention, a batch method of forming aplurality of structures, includes: (a) providing at least one structuralmaterial comprising a sheet; (b) cutting into the at least onestructural material using a laser beam that scans a first offset pathrelative to a boundary of a given one of the plurality of structures tocut into the structural material to a depth that is less than athickness of the at least one structural material; (c) cutting into theat least one structural material using the laser beam along a secondoffset path that is farther from the boundary than the first offsetpath; (d) cutting into the at least one structural material using thelaser beam along a third offset path that is farther from the boundarythan the second offset path; and (e) repeating the cutting of (b), (c),and (d) a plurality of times to cut completely through the thickness ofthe at least one structural material along the first offset path,wherein the energy delivered along the first path is greater than theenergy delivered along the second path which is greater than the energydelivered along the third path.

Numerous variations of the twelfth and thirteenth aspects of theinvention exist and include, for example, one or more of: (1) thegreater energy delivered along the first path being achieved at least inpart by use of a greater number of passes to expose the first path thanthat used to expose the second path; (2) the greater energy deliveredalong the second path being achieved at least in part by use of agreater number of passes to expose the second path than that used toexpose the third path; (3) the at least one sheet including at least twosheets of different materials; (4) the at structure or plurality ofstructures each including a plurality of components each having aboundary; (5) the variation of (4) wherein the plurality of componentsinclude at least two components that are movable with respect to oneanother; (6) in addition to the at least one sheet, at least onedeposited layer of material that the laser cuts through; (7) thevariation of (6) wherein at least one deposited layer comprises amulti-material layer with different materials located in differentlateral regions of the layer; (8) prior to laser cutting locating abridging sacrificial material on a backside of material that will formpart of the structure or structures; (9) prior to laser cutting locatinga capping sacrificial material on a front side of material that willform part of the structure; and/or (10) one or more of the variationsnoted in association with other aspects of the invention so long as suchvariations bring advantage.

Other independent aspects of the invention will be understood by thoseof skill in the art upon review of the teachings herein. Otherindependent aspects of the invention, or variations thereof, may involvecombinations of the above noted aspects of the invention. Other aspectsof the invention may involve apparatus that can be used in implementingone or more of the above method aspects of the invention or may bedirected to probes or other devices that have certain features and whichmay be formed by one of the methods set forth herein or may be formed bysome other method. Still other independent aspects of the invention mayinvolve the uses of the devices described herein as part of a probe cardor other assembly during integrated circuit testing, other electricalcircuit testing applications, other electrical connection applications,or spring force applications, or the like.

These other independent aspects, or their variations, may use variouscombinations of the aspects presented above as well as provide otherconfigurations, structures, functional relationships, and processes thathave not been specifically set forth above. Still other independentaspects, or their variations, may provide methods for using the devicesformed according to the above noted aspects.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A provides a listing of example materials that may be used invarious combinations in the various embodiments of the invention.

FIG. 1B provides a sample listing of different material combinationsthat can be used to form parts or structures (e.g. probes) havingdifferent material configurations wherein the structures themselves maytake on a variety of different structural configurations as is known inthe art.

FIGS. 1C and 1D provide a sample listing of different process steps oroperations that may be used in the process of fabricating parts orstructures according to the various embodiments of the invention and thevarious desired final structure configurations.

FIG. 2A provides a block diagram showing the major steps involved in afirst method embodiment of the invention that includes forming a part orstructure (e.g. probe) from a laser machined sheet of structuralmaterial (e.g. tungsten) and wherein prior to machining a sacrificialbridging material is located on the sheet material and wherein duringmachining the laser cuts completely through the sheet structuralmaterial (from the side opposite the sacrificial material) using one ormore passes of the laser around the perimeter of the structure (with thepossible exception of tab or tethering locations—not shown) but wherethe laser doesn't cut completely through the sacrificial material suchthat the sacrificial material connects the individual structures (orbridges the gaps between them) until the sacrificial material is removed(e.g. by etching).

FIG. 2B provides a perspective view (on the left of the page) and a cutside view (on the right of the page) of an example sheet of sheetstructural material that can be used as a structural material accordingto the first embodiment.

FIG. 2C provides a perspective view and a cut side view of an examplesheet of structural material bonded to or otherwise joined to athickness of sample sacrificial bridging material (e.g. deposited layeror layers, bonded sheet or sheets) as part of the process of forming astructure according to the first embodiment.

FIG. 2D-1 provides a perspective view and a cut side view of four samplestructures) having their outlines defined by laser cutting through thesheet structural material and leaving the structures held in theiroriginal positions by the presence of bridging sacrificial material thathas not been completely cut through and wherein the cutting used todefine each structure is completely independent of the cutting that isused to define every other structure.

FIG. 2D-2 is similar to FIG. 2D-1 with the exception that 12 structuresare shown and each structure shares a cut region with one or moreneighboring structures such that a vast majority of the regions of sheetstructural material cut through define the perimeter of more than onestructure.

FIG. 2E illustrates a perspective view and a cut side view of the fourstructures of FIG. 2D-1 after release from the bridging sacrificialmaterial such that the four structures are separated.

FIG. 3A provides a schematic illustration of one state in a process oflocating bridging sacrificial material on the sheet structural materialwherein the sheet material is set up for receiving an electrodeposit ofsacrificial material.

FIG. 3B provides a schematic illustration of another state of theprocess of FIG. 3A wherein the deposition of the sacrificial bridgingmaterial on the sheet structural material has begun.

FIGS. 4A and 4B provide schematic illustrations of two states in analternative process of locating a sacrificial material onto the sheetstructural material wherein deposition of the sacrificial materialoccurs by a means other than electrodeposition (e.g. electrolessdeposition, spray metal deposition, CVD, PVD, or the like).

FIG. 5 provides a schematic illustration of a third alternative methodof locating a sacrificial material onto the sheet structural materialwherein a sheet of sacrificial material is adhered or bonded to thesheet of structural material (e.g. via diffusion bonding, ultrasonicbonding, or the like).

FIG. 6 provides a schematic illustration of a fourth alternative methodof locating a sacrificial material onto the sheet structural materialwherein a sheet of sacrificial material is adhered or bonded to thesheet of structural material via an intermediate bonding or adhesionmaterial.

FIGS. 7A and 7B provide schematic illustrations of a potentialrelationship between a sheet of structural material, a body ofsacrificial material, and a support or base structure that may be usedin some embodiments of the invention wherein FIG. 7A shows the materialsand base initially separated while FIG. 7B shows the materials and baseafter being bought and held together and wherein the sacrificialmaterial is located between the structural material and the base.

FIGS. 8A and 8B provide schematic illustrations of a potentialrelationship between a sheet of structural material, a body ofsacrificial material, and support or base frame wherein FIG. 8A showsthe materials and frame initially separated while FIG. 8B shows thematerials and frame after being bought and held together and wherein thesheet of structural material is located between the frame and thesacrificial material.

FIGS. 9A and 9B provide schematic illustrations of another potentialrelationship between a sheet of structural material, a body ofsacrificial material, and support or base frame wherein FIG. 9A showsthe materials and frame initially separated while FIG. 9B shows thematerials after being bought and held together and wherein thesacrificial material is located between the frame and the structuralmaterial.

FIGS. 10A-10I provide nine example material stacking or depositionarrangements that may occur in some method embodiments when a solid baseis used to the support the bridging sacrificial material.

FIG. 11A-11J provide nine additional example material stacking ordeposition arrangements that may occur in some method embodiments when ahollow base frame is used as opposed to the solid base of FIGS. 10A-10H.

FIGS. 12A and 12B illustrate that in some embodiments like those shownin FIGS. 11A-11F, laser cutting can occur from both sides.

FIGS. 13A-13L depict side views of different embodiments of structuresformed from one or more layers of sheet material.

FIGS. 14A-14Q depict side views of different example embodiments ofstructures formed from one or more layers of sheet material and one ormore layers or deposits of a single material per layer (e.g. a tipmaterial).

FIGS. 15A-15K depict side views of different embodiments of structuresformed from one or more layers of sheet material, one or moremulti-material layers of deposited material, and one or more layers ofdepositions of a tip material that may or may not be part of themulti-material layers.

FIG. 16A provides a side cut view of a sheet STRMAT and a bridgingSACMAT after laser cutting from above, trimming down the upper surfaceof the distal end from above, and trimming down the lower surface of thedistal end from below such that a structure like that of FIG. 13B may beformed.

FIG. 16B provides a side cut view of a sheet STRMAT along with abridging SACMAT and a capping SACMAT after laser cutting from above,trimming down the upper surface of the distal end from above, andtrimming down the lower surface of the distal end from below such that astructure like that of FIG. 13B may be formed.

FIG. 17 provides a side cut view of a sheet STRMAT and a bridging SACMATafter laser cutting at two different angles whereby a proximal end of astructure is formed with a vertical end wall while a distal end has asloped configuration such that a structure like that of FIG. 13C may beformed.

FIG. 18A provides a side cut view of a sheet STRMAT and a bridgingSACMAT after laser cutting at two different angles whereby a proximalend of a structure is formed with a vertical end wall while a distal endhas a vertical end wall near its upper surface and a slopedconfiguration near its lower surface such that a structure like that ofFIG. 13D may be formed.

FIG. 18B provides a side cut view similar to that of FIG. 18A showing anadditional laser cutting operation that may be used in forming astructure like that of FIG. 13D wherein a small region of materialbetween the first and second distal end cuts of FIG. 18A is removedprior to performing the angled cut as seen in FIG. 18B.

FIG. 19A provides a side cut view of a sheet STRMAT and a bridgingSACMAT after laser cutting at three different angles whereby a proximalend of a structure is formed with a vertical end wall while a distal endhas an upper facing angled surface and a downward facing angled surfacesuch that a structure like that of FIG. 13E may be formed.

FIG. 19B has a similar relationship to FIG. 19A that FIG. 18B had toFIG. 18A wherein an ablation operation is used to remove the two smallpieces of sheet material prior to performing either of the angled cuts 3and 4 at the distal end of the structure.

FIGS. 20A and 20B respectively provide a block diagram of major processsteps and corresponding side cut views of various states of a process offorming an example structure according another method embodiment of theinvention wherein a plurality of structures are formed from a sheet ofstructural material and a single region formed of one or more layerswith each layer formed from a single material or formed from multiplematerials wherein the process forms the single or multi-material regionon a bridging SACMAT which in turn may be on a substrate (not shown) andafter which bonding of the single or multi-material region to a sheetSTRMAT occurs.

FIGS. 21A and 21B respectively provide a block diagram of major processsteps and corresponding side cut views of various states of a process offorming an example structure according another method embodiment of theinvention wherein a plurality of structures are formed from a sheet ofstructural material and a single region formed of one or more layerswith each layer formed from a single material or formed from multiplematerials wherein the process forms the single or multi-material regionon a sheet STRMAT (with or without first providing an adhesion layerand/or a seed layer) and then the process attaches the single materialregion or the multi-material region to a bridging SACMAT or deposits thebridging SACMAT on to such a region.

FIGS. 22A and 22B respectively provide a block diagram of major processsteps and corresponding side cut views of various states of anadditional two processes of forming an example structure accordingalternative method embodiments of the invention wherein a plurality ofstructures are formed from a sheet of structural material and a singleregion formed of one or more layers with each layer formed from a singlematerial or formed from multiple materials wherein the process providesa sheet of SRTMAT on to which either bridging SACMAT is deposited orbonded or on to which a single material or multi-material region isdeposited or bonded after which the other of the bridging SACMAT or thesingle material or multi-material regions is deposited or bonded to theother side of the sheet STRMAT.

FIGS. 23A and 23B respectively provide a block diagram of major processsteps and corresponding side cut views of various states of the processin forming an example structure according another method embodiment ofthe invention wherein a plurality of structures are formed from a sheetof structural material and two regions of multi-material layers orsingle material layers.

FIGS. 24A-24P illustrate the results of various process steps andoptional process steps that are or may be used in forming a partaccording to some alternative embodiments of the invention.

FIGS. 25A-25L illustrate the results of various process steps andoptional process steps that are or may be used in formation a pluralityof parts according to some further alternative embodiments of theinvention.

FIG. 26 provides a schematic top view of a plurality of parts to beprocessed via staged laser machining such that each part is formed froma plurality of laser exposures some having spatially coincident scansand others having offset lateral scanning positions whereby by someparts are machined in series relative to the other parts or groups ofparts or in parallel with the other parts or groups of parts or incombination.

FIG. 27 provides a schematic top view of three parts to be processed viastaged laser machining involving three offset paths per part andinvolving different exposure levels along each path and wherein thescanning of each offset path occurs via looped exposure patterns.

FIGS. 28A-28C provide various schematic top views of sample parts to beprocessed via staged laser machining that involve different non-loopbased exposure methods.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Some potentially useful probe materials (e.g. tungsten, molybdenum) andmaterials useful in micro scale or millimeter scale devices, cannot bedeposited from an aqueous solution (e.g. electrodeposited or electrolessdeposited). Such materials may, for example, have improved propertiesrelated to current carrying capacity, e.g. based on their ability tomaintain yield strength, at elevated temperatures. As noted above it hasbeen previously proposed that such materials may be used as probematerials and that they may be supplied in sheet or foil form and may beshaped by laser processing. Some useful materials may beelectrodepositiable but still might benefit from use in sheet form (e.g.palladium or platinum).

Embodiments of the present application provide commercially significantenhancements over the previously proposed methods noted above. Somepreferred embodiments involve enhanced methods of securing the sheets,or foils, of structural material and the individual parts or structuresbeing formed therefrom during laser machining processes. Some methodsprovide for improved thermal management during the laser cuttingprocess. Such securing and thermal management is made desirable by thesmall nature of the structures being formed (e.g. 1-5 mm in length and25-200 microns in thickness and width) which could allow the parts orstructures to move under very small forces during or after cutting (e.g.from heat induced stresses, gravity, internal stresses within thesheets, vibrations, etc.) which could result in degraded cuttingaccuracy and unreliable structure formation. Furthermore, since foilsfrom which the structures are to be cut have relatively little thermalmass, the structures may be heated during cutting or trimming to adegree where material properties are adversely or unpredictablyaffected.

In some embodiments, it is preferred that the foil or sheet ofstructural material be attached to another material, such as asacrificial material (e.g. copper), before cutting. After cutting thesacrificial material is removed. Such removal may occur by use of anetchant that dissolves the sacrificial material without dissolving anyexposed structural material. Alternatively, in some embodimentssacrificial material may be removed in whole or in part by other meanssuch as by melting, by further laser trimming, or possibly by machining(e.g. lapping or fly cutting, or the like). This sacrificial materialcan provide support during machining, hold the parts (e.g. probes,partially formed probes, or other structures) in place after cutting,and may act as a heat sink to remove or more uniformly distribute heatduring the machining process. In some embodiments, tethering via thinand/or narrow segments of either structural sheet material or depositedstructural material may also be used to attach structures to one anotheror to attach them to other structures until such time as they are to bereleased in preparation for assembly or after assembly. Such tetheringmay be removed during, before, or after release from a bridgingsacrificial material. In some embodiments, tethering may be provided bya second sacrificial material that is located in selected locations andthat is not dissolved by an etchant that removes a first sacrificialmaterial. The second sacrificial material may be removed after removalof the first sacrificial material and possibly after performance of oneor more intermediate processes such as depositions of structuralmaterials to selected locations on previously laser shaped structuralmaterial.

In some embodiments, prior to laser cutting, some surfaces (e.g. asurface opposite to that of the sacrificial bridging material) may becoated with one or more capping sacrificial materials (e.g. metals suchas copper, tin, silver or the like) so that any structural materialevaporated during cutting doesn't redeposit on to structure surfaces buton to such sacrificial material which can be removed after laser cuttinghas been completed. This sacrificial material may also provide forelimination or minimization of laser cutting surface effects that mayresult in misshaping of the structural material if the structuralmaterial were not overlaid by such capping sacrificial material. Thiscapping material may also provide some additional heat sink capacity. Insome embodiments, sacrificial material on each side of the structuralmaterial may act as a capping sacrificial material and a bridgingsacrificial material particularly when laser cutting may occur from bothsides of a sheet or foil structural material.

Thickness of bridging sacrificial materials and capping sacrificialmaterials may be dictated in different embodiments by different controlneeds or desires. In some embodiments the thickness of a bridgingsacrificial material may be, at least in part set, based on a desiredthat the bridging sacrificial material not be cut all the way throughand that sufficient bridging material remain to provide adequatestructural integrity, adequate planarity, or an adequate heat flow path.In other embodiments such integrity, planarity or heat flow may be atleast in part provided by a substrate on which the bridging sacrificialmaterial is located and thus the cut through avoidance might not be acontrolling parameter. In some embodiments, the thickness of a cappingsacrificial material may be dictated by a desired to minimize lasercutting time and a desire that the cutting of structural material be ata sufficient depth that surface, spot size, focus, field of vieweffects, and the like (e.g. that might result in side wall tapering) areminimized or eliminated.

Laser machining as contemplated by the various embodiments of theinvention may employ any laser cutting system that is conventionallyknown to be useful for cutting the materials being operated on, withappropriate depth control (Z-direction—direction perpendicular to theplanes of the sheets being cut) and XY positioning control. Such lasersystems may employ lasers and scanning systems with various parameters:(1) pulse periods or widths such as, for example, pulses having widthsin the nano-second, pico-second, or fempto-second range; (2) variouspowers per pulse such as, for example, powers of less than 10 uJ(microjoules) per pulse to more than 100 uJ per pulse; (3) variousrepetition rates such as, for example, in the thousands to hundreds ofthousands or more pulses per second; (4) various scanning speeds suchas, for example, 0.1 mm/second to 500 mm/second or more with effectivecut rates ranging, for example, from 0.1 to 1 or more millimeters persecond for complete cut through after all necessary passes; (5) variousbeam shapes, such as, for example (a) Gaussian—TEM 00, (b) donut—TEM 01,or (c) other higher order intensity distributions, (6) various beamdiameters, such as, for example 0.1 um to 20 ums or more), (7)correlation between scanning speed and pulse diameter to allowsufficient pulse to pulse overlap during scanning, such as, for examplefrom 10% to 90% overlap; (8) various wavelengths may be used, such as,for example IR, visible or UV from various sources including, forexample, visible or UV radiation from the fundamental frequency of anNd:YAG or excimer laser or from a frequency multiplied version of thefundamental, for example, 2 or 4 times the fundamental of an Nd:YAG orexcimer laser. Such laser systems will include scanning systems that canmove the laser beam and/or the workpiece at appropriate relative speedsto allow efficient and controlled cutting of the material (e.g.rotational scanning mirrors for the laser beams and/or translationsystems for the workpieces). Such laser systems will include scanningprotocols that provide for appropriate and controlled relativepositioning of the laser beam on the workpieces so that cutting occursonly at appropriate positions on the work piece while the beam is movingand pulsing at appropriate synchronized rates. Such systems include fastshutters such as, for example, acousto-optical modulators to turn thebeam on when appropriately positioned and scanning at appropriate speedswith appropriate pulse power and to turn the beam off when not properlypositioned, not traveling at an appropriate speed, or outputtingappropriate pulse power. Such systems will include computer or othercontrol systems for translating device geometries into appropriatescanning control commands. Such systems may perform cutting completelythrough the structural material or materials in a single pass of thelaser beam, in a series of exactly repeated passes of the laser beam toachieve desired cutting depths, or in a series of offset but overlappingpasses. In some implementations, non-laser cutting operations may beperformed between some or all successive passes such as, for example,cleaning operations deposition operations, chemical etching operations,or the like. Depending on the material or materials being cut and themethod of removal, such exposures may occur in normal atmosphere (i.e.air or dry air), an inert atmosphere (e.g. N₂ or Ar), a reducingatmosphere (e.g. H₂), an oxidizing atmosphere (e.g. O₂), in asurrounding body of liquid non or low radiation absorbing liquid, or thelike. Such systems may include the ability to change the scanningdirection of the laser beam from the front side of a workpiece to a backside of the workpiece along with appropriate calibration andregistration protocols to ensure adequate registration of cuttinglocations from side-to-side. Some embodiments may include the ability torotate or translate the workpiece to change the beam cutting directionfrom, for example, front side to back side or from one incident angle onthe front side to a different incident angle on the front side, or thelike. Some embodiments may use dual laser cutting systems to cut onopposite sides of a work piece simultaneously. Some embodiments may usefocal length adjustment systems or translation systems of scanningmirrors or for workpieces to ensure minimal variation in beam size at aworking location on a work piece and or to minimize variations in angleof incidence from position to position. Such systems may rely on datathat takes into consideration effective beam diameters (i.e. cuttingradius between the position of the beam center and the removal boundary)or alternatively may position the beam using required offsets based ondata supplied in uncompensated form.

As noted above, other methods of forming structures have involved theelectrodeposition of various materials such that structures are built upfrom a plurality of adhered layers of multiple materials where eachlayer includes at least one sacrificial material and at least onestructural material. In some such embodiments, two or more structuralmaterials along with at least one sacrificial material are deposited aspart of each layer. Each layer is typically planarized after formationto set accurate vertical part dimensions. Example of such fabricationmethods and probes formed from such fabrication methods can be found inthe following US Patents and Patent Application Publications. Each ofthese patents and publications is incorporated herein by reference.

Patent or Publication No. Title/Topic 7,273,812 Microprobe Tips andMethods for Making 2006-0108678 Probe Arrays and Methods for Making7,531,077 Electrochemical Fabrication Process for Forming MultilayerMulti-material Microprobe Structures (including encapsulation of a corematerial by a shell material) 2005-0184748 Pin-Type Probes forContacting Electronic Circuits and Methods for Making Such Probes7,557,595 Cantilever Microprobes For Contacting Electronic Componentsand Methods for Making Such Probes 2006-0238209 Vertical Microprobes forContacting Electronic Components and Method for Making Such Probes2007-0158200 Electrochemical Fabrication Processes IncorporatingNon-Platable Materials and/or Metals that are Difficult to Plate On2008-0050524 Methods of Forming Three-Dimensional Structures HavingReduced Stress and/or Curvature 2010-0134131 ElectrochemicallyFabricated Microprobes 2011-0132767 Multi-Layer, Multi-MaterialFabrication Methods for Producing Micro-Scale and Millimeter-ScaleDevices with Enhanced Electrical or Mechanical Properties

Though some embodiments of the invention form probes and other devicesonly from sheet material that is laser cut, other embodiments of theinvention use various single material or multi-material, single layer ormulti-layer deposition methods in combination with sheets and lasercutting, and possibly in combination with additional elements and/orsteps to provide new and improved fabrication methods and/or new andimproved structures, parts, or devices (e.g. probes).

Some embodiments form probes or other structures from one or more layersof sheet material. Sheet material may include for example tungsten (W),tungsten-rhenium (WRe), molybdenum (Mb), beryllium-Copper (BeCu),palladium (Pd), platinum (Pt), Iridium (Ir), platinum-iridium (Pt—Ir),titanium (Ti), nickel (Ni), copper (Cu), rhodium (Rh), gold (Au), silver(Ag) and alloys containing these and possibly other metals, and evencontaining dielectric materials. These materials may be patterned intodesired cross-sectional shapes by the cutting out desiredconfigurations. In some multi-sheet embodiments, the sheets may bebonded to one another prior to any laser machining while in otherembodiments some laser machining may occur on one or more sheets priorto bonding and with the final perimeter cross-sections of parts beingcut out after bonding has occurred or possibly the cutting may cause orenhance bonding of these perimeters as it occurs.

Some embodiments will add one or more multi-material layers to the sheetor sheets of material to form enhanced structures. The multi-materiallayers may be formed by one or more of the processes as set forth in thepatents, patent applications, or other publications set forth in thetable above. In some embodiments these multi-material, multi-layerstructures will be formed on the sheet material or formed separately andthen bonded to the sheet material. When forming a first multi-materiallayer on a sheet of material, an adhesion layer (e.g. W—Ti, Cu, or Au)having a thickness of the order of 1 s to 10 s to 100 s of nanometers)may be initially deposited by sputtering, PVD, or the like as necessary.Next, a seed layer may be deposited (e.g. Cu, Au, Ni, or the like) maybe deposited by sputtering, PVD or electroless deposition as necessary.Alternatively, if the original adhesion layer is adequate, a strikedeposition may be used to provide an activated surface for receivingsubsequent electrodeposited material. Thereafter, a first material maybe pattern deposited via openings in a photolithographically fabricatedmask, pattern deposited via openings formed by direct ablation of amasking material, patterned deposited via a direct selective depositionprocess. After deposition of one or more materials as part of a givenlayer, a subsequent material forming part of the given layer may bedeposited in a patterned manner or blanket manner into a mold ofpreviously deposited material or materials. After deposition of all orpart of the materials forming a given layer planarization operations(e.g. lapping, fly cutting, CMP, other machining, or the like) may beused to smooth planarize, or controllably roughen the surface, and/or toset an orientation for the surface and in the end to set a finalthickness for the given layer. In such embodiments, one of two depositedmaterials is generally a sacrificial material while the other is astructural material. Basic processes for such formation are set forth inU.S. Pat. Nos. 6,027,630 and 5,190,673. In more advanced embodiments,where more than two materials form part of a given layer (exclusive ofseed layers and adhesion layers) one or more of the deposited materialsare structural materials and one or more are sacrificial materials. Insome advanced processes, interlacing of materials deposited inassociation with specific layers occurs and may provide enhancedadhesion or strengthening of interlayer bonds. Examples of suchprocesses are found in U.S. Pat. No. 7,252,861 which is incorporatedherein by reference. Such multi-material deposits may be made oversheets, or sheets with deposited material, that already contains lasercut patterns such that the subsequently deposited material or materialsnot only lay on the top or bottom surfaces of the sheet material or ontop or bottom surfaces of other deposited materials but also are locatedon the sides of the cut regions.

In some embodiments, deposited material for a layer might be in the formof a single material as opposed to being in multi-material form. Suchdeposits of single materials may or may not benefit significantly fromplanarization. Such deposits of single materials may take on desiredpatterns by subsequent laser cutting or ablation. Such deposits may bemade over sheets, or sheets with deposited material, that alreadycontains laser cut patterns such that the subsequently depositedmaterial or materials not only lay on the top or bottom surfaces of thesheet material or on top or bottom surfaces of other deposited materialsbut also are located on the sides of the cut regions.

In the various embodiments set forth herein, descriptions of layers andformation of layers and multi-layer stacks are provided as if stackingoccurs from a bottom layer to a top layer, along a vertical or Z-axis,with each layer having a thickness that is measured as a height inZ-direction while each layer extends laterally in an XY plane. Though anupper layer or subsequently formed layer is considered to be formed onand after a lower layer or previously formed layer, it is not intendedthat this type of description necessarily convey a gravitationalorientation of the building. Gravitationally speaking, unless otherwisespecified, upper layers may be formed above, beside, or below lowerlayers. Alternative labeling of axes doesn't change the fact that thelayers are stacked along their height or thickness along one axis andhave lateral extends along the other two substantially perpendicularaxes. In some alternative fabrication methods, layers need notnecessarily be planar but may take on other shapes (e.g. cylinders,spheres, or the like) wherein each position on a layer has localstacking direction and two substantially local perpendicular lateraldimensions that are, at least locally, perpendicular to the stackingdirection. Different lateral positions or dimensions refer to differentXY positions or dimensions in an XY plane of a layer or on multiplelayers relative to a Z-axis height of the layer or stacking direction ofthe layers.

As noted above, structures may be formed from non-planar layers. Suchnon-planar layers may take on any form which is beneficial to objectformation (e.g. the layer may have a cylindrical configuration,spherical configuration, a toroidal configuration, or the like). Whenforming structures with such alternative layer configurations, the layermay still be subject to some form of smoothing and layer thicknesssetting operations (e.g. for cylindrical structures, after deposition ofa single or multi-material layer, the layer may be subjected tocylindricalization by use of a lathe or micro-lathe, rotating thestructure against a surface holding a non-fixed abrasive, inserting thestructure into a rotating abrasive sleeve having a fixed or adjustabletrimming surface, and the like. In some embodiments one or moretransitions between layer configurations may be made (e.g. a firstnumber of layers may be cylindrical in nature while one or moresubsequent layers may be planar in configuration). In some embodimentsthe layer stacking orientation may change from one axis to another axis(e.g. a first number of layers may be formed with a first orientationsuch as stacking along the Z-axis while one or more subsequent layersmay be reoriented such that stacking occurs along the X or Y axes. Insome embodiments stacking may occur from a 1^(st) to n^(th) layer in apositive Z-direction whereafter continued stacking may occur from thebackside of the 1^(st) layer with the formation of an (n+1) layer to anr^(th) layer along the negative Z-direction.

FIG. 1A provides a sample listing of some materials that may be used invarious combinations in the various method embodiments of the invention.In some embodiments all such materials may be used, in other embodimentsonly a portion of the materials may be used. In some embodiments, somematerials may be used multiple times. Some such materials may form partof the structure while other materials may be separated from thestructures (e.g. probes) prior to putting them to use (i.e. these mightbe considered sacrificial materials and reusable materials such assubstrates, bases, frames, and the like). In the various embodiments ofthe invention, structures may be formed using one or more of: (A) sheetstructural material, i.e. sheet STRMAT, (B) bridge sacrificial material,i.e. bridge SACMAT or BSACMAT, that is formed by depositing it; (C)bridge SACMAT that is supplied in sheet form, (D) sacrificial materialthat is a part of a multi-material layer, i.e. X-MAT SACMAT or justSACMAT, (E) structural material that may be used as an exposed part of alayer, i.e. external STRMAT, (F) structural material that will not beused as an exposed part of a layer and thus may have differentproperties from external STRMAT, i.e. internal STRMAT, (G) a structuralmaterial used as a contact material, i.e. TIPMAT or tip STRMAT, (H) anadhesion layer material and/or barrier layer material, (I) a seed layermaterial, (J) a bonding material, i.e. BONDMAT, for either aiding in thebonding of layers or for aiding in the bonding of the structure toanother element, wherein such bonding material may be supplied in sheetform or in deposited form; (K) capping material, i.e. CAPMAT, which maybe a sacrificial material used to protect a structural material fromdebris when laser cutting and which may be provided in deposited orsheet form; (L) conductivity improvement material, i.e. CONMAT, whichmay be a structural material having a lower melting point than the sheetmaterial but which provides for enhanced current carrying capacitywithout necessarily relying on the yield strength of this CONMAT forstructural properties, such as spring coefficient at operatingtemperature, and which may be initially provided in deposited or sheetform; and (M) dielectric material, i.e. DIMAT, which may be a structuralmaterial which may, for example, provide some insulation or shortingprotection between adjacent electrical elements. In someimplementations, structures formed according to the methods of thepresent invention may include only conductive materials (e.g. metals)while in others they may include dielectrics, semiconductors, or thelike. Some structures may include ceramics.

FIG. 1B provides a listing of examples of different materialcombinations that can form structures having different materialconfigurations. For example, probes may take on a variety of differentstructural configurations as is known in the art (e.g. vertical probeconfigurations, cantilever probe configurations, multi-beam cantileverprobe configurations, pin probe configurations, torsional probeconfigurations, solder mounting configurations, slot or hole mountedconfigurations, and the like). In the examples of FIG. 1B, structures orparts (e.g. probes) may be formed of: (A) a single sheet of sheetSTRMAT, (B) multiple sheets of sheet STRMAT with or without intermediateadhesion or bonding material, (C) one or more sheets of sheet STRMATalong with a TIPMAT, (D) one or more sheets of sheet STRMAT along withone or more regions of additional non-tip STRMAT such as a BONDMAT, aCONMAT, and/or a DIMAT, (E) one or more sheets of sheet STRMAT alongwith one or more regions of additional STRMAT and one or more regions ofat least one TIPMAT, (F) one or more sheets of STRMAT along with one ormore regions of additional external STRMAT and one or more regions ofinternal STRMAT, or (G) one or more sheets of sheet STRMAT along withone or more regions of additional external STRMAT, one or more regionsof internal STRMAT, and one or more regions of TIPMAT. As needed any ofthese material configurations may additionally include adhesionmaterials and seed layer materials.

Method Embodiment Steps

FIGS. 1C and 1D provide a listing of example process steps or operationsthat may be mixed and matched in the processes of some of the methodembodiments of the invention (e.g. for fabricating probes). Mostembodiments will only use a portion of the indicated steps though somesteps may be used multiple times and in varying orders. For example,many embodiments will use a single deposited bridging sacrificialmaterial while others may use two separate bridging sacrificialmaterials while still others may use no bridging sacrificial material.Bridging sacrificial material, whether deposited or in sheet form, maybe formed on or bonded to the sheet STRMAT or formed on or bonded tosome other layer from which the structures will be formed. As anotherexample, some embodiments may form a single region of one or moremulti-material layers while other embodiments may use multiple regionsof one or more layers with each formed from multiple deposited materialsoccupying different lateral extents or positions of their respectivelayer(s), while still other embodiments may not use any regions formedfrom one or more multiple material layers. As another example, someembodiments may form a single region or one or more single materiallayers while other embodiments may use multiple regions of one or moresingle material layers while still other embodiments may use no regionsof one or more layers of single materials (other than a sheet material).As a further example, some embodiments may have regions including one ormore multi-material layers as well as one or more single materiallayers. As a final example, some embodiments may make holes in sheetmaterial or other deposited material layers that will be occupied by oneor more subsequently deposited materials. After review of the teachingsherein, one of skill in the art will understand that that steps setforth herein may be used in various combinations to form structureshaving a variety of properties and material configurations. It isapplicant's intent that method embodiments of the invention include eachpossible combination and subcombination of these steps that may be usedto produce viable structures, components, or assemblies. The mostpreferred embodiments are directed to micro-scale structures andmillimeter-scale structures (e.g. structures having Z heights,perpendicular to the plane of the layers, in the range of 10 um to 5 mm,X and Y dimensions on the order or 10 um to several centimeters, with afeature resolution on the order of 1-100 um) but in some cases thestructures may be larger or smaller. Example steps include:

(A) Laser Cutting Through Sheet STRMAT to Form External Probe Boundarieswithout Leaving Tabs or Tethers.

This cutting may occur by cutting with (1) one or more laser beamsincident on the sheet from a single side of the sheet, e.g. from the topor the bottom, (2) one or more laser beams incident on the sheet frommultiple sides either in series or simultaneously (e.g. from the top ofthe sheet and then from the bottom of the sheet), (3) one or more laserbeams using a single incident angle, e.g. cutting with the laser beamhaving an incident angle that is perpendicular to the surface, cuttingwith the laser beam being held at a fixed, constant, andnon-perpendicular angle relative to the surface being cut (i.e. notparallel to a local surface normal), or (4) one or more laser beamshaving incident angles changing depending on the specific feature of theprobe being formed, e.g. tips may be formed to have features that tapperin Z so that they have contact regions thinner than the thickness of thesheet material or deposited materials from which they are formed or suchthat material from which they are formed may mechanically interlock withother materials. A beam or beams with fixed or changeable incidentangles may be incident upon one or both surfaces of a sheet or othermaterial to be cut. Cutting of sheet material may occur before or afterbonding any other sheet materials or after deposition or bonding ofdepositable materials. This step may also be used to cut boundaries orperimeters around deposited structural materials or even sacrificialmaterials. This step may occur by cutting through a front side cappingsacrificial material but not completely through a backside bridgingsacrificial material. This step may occur by cutting through a frontside capping sacrificial material and completely through a back sidesacrificial material. This step may occur by cutting from a front sidecompletely through a capping sacrificial material but not completelythrough a bridging sacrificial that is on the backside and thereafter afront side bridging sacrificial material may be applied after whichcutting may occur from the backside through the original bridgingsacrificial material that is now acting as a capping material whereinthe cutting continues until a depth of cutting reaches completelythrough the structural material but not completely through the frontside bridging sacrificial material.

(B) Laser Cutting Though Sheet STRMAT to Form External Probe Boundarieswhile Leaving Tabs (e.g. for Use in Tethering).

This step includes options similar to those noted for step (A). Thisstep may be used to leave tabs in selected locations of a depositedstructural material and/or in sheet STRMAT. This step may cut completelythrough portions of the bridging sacrificial material while leavingselected regions of bridging sacrificial material uncut. This step maybe applied in the presence of two sacrificial materials occupyingdifferent lateral regions of one or more layers such that removal of oneof the sacrificial materials still leaves the structure tethered by asecond sacrificial material.

(C) Laser Cutting or Machining of Notches or Grooves into Sheet STRMATto Form Recesses within the Sheet STRMAT.

This step includes options similar to those noted for step (A). Thisstep may also be used to cut notches or grooves into other structuralmaterials or even in sacrificial materials in preparation for depositionof additional structural materials. This step may be used to definefeatures of narrower thickness than that of the sheet material or thatof the combination of structural materials (e.g. narrow tip regions).

(D) Laser Cutting or Machining Sheet STRMAT to Form Internal Holeswithin the Sheet STRMAT.

These holes may, for example, form external boundaries of thestructures, e.g. regions between the beams of a multi-beam cantileverprobe, or alternatively they may form openings for receiving additionalstructural material. This step includes options similar to those notedfor step (A). This step may also be used to cut or machine openings inother structural materials or even in sacrificial materials (e.g.bridging sacrificial materials). The openings cut may be specific toindividual parts or they may be extended to define common portions ofmultiple parts (e.g. ends of probes such as tip regions or base regionsparticularly when those end portions are to receive a deposit of one ormore structural materials before laser cutting defines the side profilesof the probes. The openings may be extended while still definingspecialized features for individual parts (e.g. curved tip regions forindividual probes represented by a plurality of individual bulges withina substantially rectangular cut that extends past a plurality of probes.This process may define common guide holes extending perpendicularlyfrom a front surface to a back surface which may be used as alignmentmarks when cutting part outlines from both sides of a sheet or amaterial stack.

(E) Laser Cutting Only Part Way Through BRIDGE SACMAT.

In embodiments where a single region of BRIDGE SACMAT is used, this stepallows the BRIDGE SACMAT to act as a bridge that retains structures inknown and controlled locations during and after complete cutting throughthe sheet STRMAT and possibly through other materials. This stepincludes options similar to those noted for step (A).

(F) Laser Cutting Completely Through BRIDGE SACMAT in SelectedLocations.

This step may be used, in a variety of circumstances, e.g. whereselected features of a structure, formed of either sheet STRMAT or someother STRMAT are intended to be cut, machined, or trimmed and access isonly available from the backside (or bridge SACMAT side). This step maybe used when the bridging SACMAT is to be bonded to a substrate whichcan provide the needed dimensional stability. This step includes optionssimilar to those noted for steps (A) and (D).

(G) Depositing BRIDGE SACMAT onto a Substrate

(e.g. a reusable substrate, a sheet STRMAT, a multi-material region, oron some other STRMAT to form a combined STRMAT and bridge SACMATworkpiece). In some embodiments the substrate may be a temporarysubstrate with the deposited bridge SACMAT eventually being transferred,relatively speaking, to the sheet STRMAT, a multi-material region, orsome other STRMAT.

(H) Depositing One or More Layers or Partial Layers of a STRMAT, aSACMAT, Adhesion Material, Seed Layer Material, Barrier Material,Bonding Material, or the Like.

Such layers may be planarized after deposition to ensure appropriatethickness and uniformity. If partial layers are to be formed, they maybe formed by controlled and targeted deposition or by deposition in atemporary molding material (e.g. photoresist) which may then be removed.These layers may be deposited directly on a surface to which they willpermanently remain or on a temporary surface from which they willeventually be transferred or removed. STRMAT deposited in this manner,in the case of spring-like electrical contacts, may take the form of tipor contact material, additional spring material, a material of highelectrical conductivity, a material to enhance bonding of the contactelement when forming an assembly, and the like. The deposits of suchmaterials may occur onto a sheet material. For example, the deposit ofSTRMAT or SACMAT on to a sheet material (e.g. tungsten) may involvesputtering of a seed or adhesion layer, an electroplated strike (e.g.acid strike) deposit, followed by a thicker electrodeposit of thedesired material. The sputtering and strike may involve deposition ofmaterials that are the same or different from one another and that arethe same or different from the electroplated STRMAT or SACMAT.

(I) Depositing One or More SACMATs and One or More STRMATs as Parts of aMulti-Material Layer.

These deposits may form a layer that in turn receives one or moreadditional deposits that form one or more additional multi-materiallayers or single material layers. If necessary, such multi-materiallayers may be planarized after deposition to ensure appropriatethickness and uniformity of the layers formed. Methods for forming suchmulti-material layers may include one or more selective depositions, acombination of selective depositions and blanket depositions, acombination of blanket depositions and selective etching operations, andpossibly one or more planarization operations. Selective depositionoperations may include controlled and targeted deposition, selectivedeposition via lithographic methods or direct laser ablation methods.Depositions may occur, for example, by electrodeposition methods,electroless deposition, spray metal deposition methods, and the like.Planarization may occur using single step or multi-step lapping, CMP,fly cutting, or the like. These layers may be formed on and bondeddirectly on a surface to which they will permanently remain or on atemporary surface from which they will eventually be transferred orremoved. STRMAT deposited in this manner, in the case of spring-likeelectrical contacts, may take the form of tip or contact material, aspring material (possibly in addition to any spring properties providedby a sheet material), a material of high electrical conductivity, amaterial to enhance bonding of the contact element when forming anassembly, and the like. Numerous methods for forming such layers are setforth in many of the patents and patent applications incorporated hereinby reference.

(J) Bonding or Otherwise Adhering Sheets to One Another, Bonding orOtherwise Adhering Deposited Layers to One Another, Bonding or OtherwiseAdhering Sheets to Layers.

When structures are to be formed of multiple sheets, layers ofmaterial(s), or a combination of layers and sheets, steps must be takento ensure adequate adhesion or cohesion of materials. Such adhesion maybe aided by cleaning and activation of surfaces, and maintainingsurfaces in appropriate atmospheres (inert, vacuum, reducing, and thelike). Such adhesion may be occur by the direct deposition of one of thematerials, e.g. via electrodeposition or electroless deposition, on theother with or without first using an adhesion material and possibly aseed layer material. Adhesion may be promoted by deposition of anadhesion material and if necessary a barrier material on one or bothpre-formed surfaces and then bringing the coated surfaces together tocause bonding. Pressure, heat, or vacuum, may be used to enhance suchbonding. Depending on the final application, application of an adhesivebonding agent on one or both surfaces may be adequate to provide thedesired level of bonding. Depending on the types of materials beingbonded and the dimensions of the structures being formed, appropriatelaser cutting methods may also provide a welding of the edges of thesheets or layers to one another. In some cases, using a laser to formnotches or even undercuts in one or both surfaces may aid in formingmechanical interconnections when pressing materials together. Suchundercuts may also be useful when depositing one material on another toimprove adhesion. These methods may, for example, be used to providebonding between a bridge SACMAT and a sheet STRMAT, bridge SACMAT and amulti-material region or a single material region, some other STRMAT, asheet STRMAT and a multi-material region or a single material region, ora multi-material region and a single material region. In some morespecific examples, one may start with a sheet STRMAT and then deposit abridging SACMAT on one or both sides of it; one may start with a STRMATand then deposit a multi-material region on one side of it and thendeposit a SACMAT on either the other side of the sheet STRMAT or on themulti-material region; one may start with a sheet STRMAT and thendeposit a multi-material regions on one side of it followed bydepositing an adhesion material (e.g. titanium, chromium, gold) on themulti-material region and on one side of a second sheet STRMAT and thenpressing the side of the second sheet STRMAT with the adhesion materialto the adhesion material on the multi-material region (possibly whileheating) to cause bonding.

(K) Selective Modification of One or More STRMATs.

In some embodiments it may be desirable to change the properties of oneor more STRMATs before or after laser cutting or even before or aftercompleting the stacking and bonding of layers and sheets. Suchmodifications can take a variety of forms depending on the materialsbeing used and the final properties to be obtained. Heating and coolingof selected material may be used to change their properties (e.g. tochange the crystal structures of metal), heating and pressure may beused not only to cause bonding but to cause alloy formation. Heating mayoccur in a variety of atmospheres to yield different results. Adding ofdopants along with heating may be used to obtain improved surfaceproperties, e.g. hardening tungsten by carburization, e.g. heating at atemperature of 1400-2000° C. of tungsten with carbon black in thepresence of a reducing atmosphere or in vacuum. In such modificationprocesses the treatment material can be selectively applied and/orheating can be selectively applied so that modifications occur atdesired locations under appropriate control.

(L) Removal of Sacrificial Materials (SACMATs).

Removal may occur in a variety of ways and depending on the SACMAT orSACMATs to be removed, it may occur after laser cutting is complete,between multiple laser cutting operations, before and/or after alllayers or sheets are formed or bonded. Removal may occur, for example,by etching, ablation, or melting. Different SACMATs may be removed atdifferent times based on different etching requirements, meltingtemperatures, or selective application of ablation. Some retainedSACMATs may act as tethers that may be later removed without need forfurther cutting operations and the difficulties, problems, and/or extraprocessing time that they might involve.

(M) Conformal Deposition of a STRMAT (e.g. TIPMAT, CONMAT, BONDMAT, orDIMAT) with Structural Material (e.g. SHEET MAT) Tethering Element(s) inPlace.

Such depositions may occur on one or both sides of a sheet material oron a sheet material with previously deposited material. They may also beapplied in openings that have been cut partially into or completelythrough the sheet material or previously applied coatings.

(N) Conformal Deposition of a STRMAT with a First SACMAT Removed fromOne Lateral Area but a Second SACMAT Located in a Different LateralArea.

The second SACMAT may be conductive or dielectric. The second SACMAT mayact as form of tethering, as a deposition barrier, as a shield forinhibiting deposition of the SRTMAT to selected areas which may becomeoverplated with the STRMAT and then allowing the STRMAT to be removedfrom only the overplated areas via a planarization process.

(O) Conformable Deposition of a STRMAT.

Such depositions may in a selective or blanket manner and may occur onone or both sides of a sheet material or on a sheet material withpreviously deposited material. They may also be applied in openings thathave been cut partially into or completely through the sheet material orpreviously applied coatings. They may be deposited in the presence ofmasking materials (e.g. patterned photoresist) or previously depositedsacrificial or structural materials and they may be partially removedfrom all lateral areas by planarization or completely from some areas byplanarization.

As noted above, different method embodiments of the invention may mixthe above steps in a variety of different ways to yield not onlydifferent fabrication methods but also to yield structures (e.g. probes)with different structural, material, and functional properties. Forexample, a BRIDGE SACMAT may be located on the same side of sheet STRMATas X-LAYER STRMAT or on the opposite side. In some embodiments theformation steps may be performed to build up structures on asubstantially planar layer-by-planar layer basis. In some embodiments,the formation steps may result in interlacing of material between atleast some successive layers. In some embodiments laser cutting mayoccur multiple times during formation of a part (e.g. a probe whereinthe multiple laser cutting steps are separated by other steps (e.g.deposition operations, etching operations, planarization operations,bonding operations, or the like). In some embodiments laser cutting maybe used to at least partially define structural boundaries of depositedSTRMAT as well as sheet STRMAT. In some embodiments additional steps maybe used in the formation process as will become apparent to those ofskill in the art upon review of the teachings herein.

Method Embodiment No. 1

A first specific method embodiment of the invention provides for theformation of a plurality of structures from a foil or sheet material inconjunction with the use of a bridging SACMAT. FIG. 2A provides a blockdiagram showing the major steps involved in this first method embodiment100 of the invention wherein a structure or structures (e.g. probes) areformed from a laser machined sheet of structural material (e.g.tungsten) and wherein prior to machining a sacrificial bridging materialis located on the sheet material and wherein during machining the lasercuts completely through the sheet structural material using one or morepasses of the laser around the perimeter of the structures or perimetersof the structures (with the possible exception of tab or tetheringlocations) and wherein the laser doesn't cut completely through thesacrificial material such that the sacrificial material connects theindividual structures (or bridges the gaps between them) until thesacrificial material is eventually removed (e.g. by etching).

In a first step 101, data for one or more individual structure types(e.g. more than one type of structure configuration may be formed fromthe same sheet during a given process) are processed into cutting pathdata for use in fabricating a plurality of structures in a batchprocess. This data processing may involve defining the cutting paths tobe followed by the laser around the perimeters of the pins. Theprocessing may involve offsetting of the laser cutting paths from theboundary perimeters of the structures to account for effective laserbeam cutting widths or different widths if variable cutting depths areto be employed. The data processing may involve use of automatic ormanual setting of processing parameters or preferences such as pulsepower, pulse during, pulse width, pulse repetition rate, beam incidentangle, cutting depth, depth of cut per pass, offset per pass, incidentsurface identification (e.g. top or bottom). This information is used ina fourth process step as discussed below. In alternative embodiments,though less preferred, it is possible to produce laser cutting path datawithout necessarily deriving it from data descriptive of the part orparts to be formed.

In a second step 111, a bridging SACMAT (or sacrificial material) islocated on the backside of a sheet STRMAT (or structural material). Insome variations of this process the bridging sacrificial material is ametal, such as copper. Depending on the initial form of the bridgingSACMAT locating may occur by bonding a sheet of bridging SACMAT to thesheet of STRMAT or by the deposition of bridging SACMAT on to the sheetof STRMAT. Such deposition may require or benefit from first applying anadhesion layer and then a seed layer or strike layer in the case ofelectrodepositing of the bridging SACMAT.

In a third step 121, the sheet STRMAT, and possibly the bridging SACMATare prepared so that structures may be cut out from the front side. Thispreparation may occur completely before step 111, in part before step111, or completely after step 111. This preparation may involve locatingthe bridging SACMAT or the sheet STRMAT on a base or frame for holdingor moving during the laser cutting operation. This preparation mayinvolve locating the sheet STRMAT and associated bridging SACMAT in alaser cutting machine. In some embodiments, this preparation work may belargely eliminated if the locating of the SACMAT on the sheet STRMAToccurs in the laser cutting apparatus.

In a fourth step 131, the material to be cut and the processed data arebrought together in the laser cutting system and cutting is made tooccur such that the sheet STRMAT is cut completely through but thebridging SACMAT is not cut completely through such that the bridgingSACMAT provides a bridge of material that continues to hold the cutstructures in place. In some alternatives implementations as noted inbelow, tethering elements of structural material may remain such thatstructures remain connected to one another or to a frame network.

Next the process moves forward to a fifth step which involves one of twooptions. If no tethering exists, step 5 takes the form of block 141-1but if tethering exists the step takes the form of block 141-2. In block141-1, bridging SACMAT is removed from the structures and any remainingsheet STRMAT to release the structures from the SACMAT and from eachother.

From block 141-1 the process moves to a sixth step as illustrated byblock 151-1 which calls for the gathering of the structures, performanceof any required inspections or tests and putting the acceptable sheetSTRMAT structures to use.

If tethering exists, the fifth step, as illustrated by block 141-2,calls for the removal of the bridging SACMAT from the structures and anyremaining sheet STRMAT to release the tethered structures, 141-2. Fromstep 141-2 the process move forward to a sixth optional step ofperforming any additional processing steps (e.g. depositions) that mightbe desired before removing the tethers.

From block 146-2 the process moves forward to a seventh step, asillustrated by block 151-2, that calls for, in a desired order that isnot dictated, cutting of the tethers, performing of any requiredinspections or tests, and putting the acceptable sheet STRMAT structuresto use.

FIG. 2B illustrates a perspective view (on the left of the page) and acut side view (on the right of the page) of an example sheet of sheetstructural material 122 that can be used as a structural material(STRMAT) according to the first embodiment.

FIG. 2C illustrates a perspective view and a side cut view of an examplesheet of structural material bonded to, or otherwise joined to, athickness of sample sacrificial bridging material (e.g. deposited layeror layers or bonded sheet or sheets) 112 as part of the process offorming a structure according to the first embodiment.

FIG. 2D-1 illustrates a perspective view and a side cut view of foursample structures 152 having their outlines 132-1 defined by lasercutting through the sheet structural material 112 and leaving thestructures held in their original positions by the presence of bridgingsacrificial material that has not been completely cut through andwherein the cutting 132-1 used to define each structure 152 iscompletely independent of the cutting that is used to define every otherstructure.

FIG. 2D-2 is similar to FIG. 2D-1 with the exception that 12 structures152 are shown and each structure shares a cut region 132-2 with one ormore neighboring structures such that a vast majority of the regions ofsheet structural material 122 cut through define the perimeter of morethan one structure while some cut regions 132-1 define the boundary of asingle structure.

FIG. 2E illustrates a perspective view and a side cut view of the fourstructures of FIG. 2D-1 after release from the bridging sacrificialmaterial and sheet structural material that was not part of a formedstructure such that the four structures are separated one from another.

In some variations of the process of FIGS. 2A-2E, in addition to use ofa bridging sacrificial material, a capping sacrificial may have beenplated or otherwise located on the front side of the sheet so thatdebris from laser cutting could not redeposit onto the upper surface ofthe sheet STRMAT. In these alternatives, the capping sacrificialmaterial may be removed when the bridging sacrificial material isremoved. In other variations of this first embodiment, the sacrificialbridging material may be attached to a substrate or frame prior to lasercutting. In such variations the substrate may provide the neededstructural support and it may be possible to cut completely through thebridging sacrificial material during laser cutting.

Methods for Forming Sheet STRMAT and Bridging SACMAT Workpieces

FIG. 3A provides a schematic illustration of one state in a process oflocating bridging sacrificial material on the sheet structural material122 wherein the sheet material (e.g. tungsten) is set up for receivingan electrodeposit of bridging sacrificial material from anode 112-1 viaplating solution 117. In some variations of the process, an adhesionlayer and seed layer may be located on the sheet structural material,e.g. by cleaning and then applying an adhesion material (e.g. titanium,chromium, tungsten, gold, or a combination by sputtering) and then aseed layer material (e.g. gold, silver, copper, nickel, or the like bysputtering) prior to beginning electrodeposition of the sacrificialmaterial (e.g. Cu). In still other alternatives, a seed layer may beused without a separate adhesion layer. In still other alternatives,neither an adhesion layer nor a seed layer may be needed. In still othervariations, a strike or flash deposition may be initially used (i.e.plating using a high current density along with a plating bath with alow ion concentration) which may be followed by further electroplating.

FIG. 3B provides a schematic illustration of another state of theprocess of FIG. 3A wherein the deposition of the sacrificial bridgingmaterial 112 on the sheet structural material 122 has begun as shown bythe arrows 118. In some variations, the deposited sacrificial material112 may be planarized after deposition to ensure a desired thickness,desired co-planarity with the surface of the sheet structural material,or simply to obtain a desired level of planarity of the surface of thedeposited material. In some variations of the process of FIGS. 3A and 3Ba second anode may be used simultaneously or in series to deposit acapping SACMAT on the other side of the sheet material. The depositionof materials on opposite sides of the sheet may result in the same ordifferent thicknesses of deposit. It is believed that in general acapping SACMAT may not require a thickness as great as that of thebridging SACMAT.

FIGS. 4A and 4B provide schematic illustrations of two states in analternative process of locating a sacrificial material 112 onto thesheet structural material 122 wherein deposition of the sacrificialmaterial occurs by a means other than electrodeposition (e.g.electroless deposition, sputtering, PVD, spray metal deposition, or thelike) from source 112-1. FIG. 4A shows the state of the process justafter deposition begins while FIG. 4B shows the state of the processafter deposition has been completed and possible planarization hasoccurred. As with the example of FIGS. 3A and 3B, a variation of theprocess of FIGS. 4A and 4B may involve deposition of a second body ofSACMAT on the opposite side of the sheet material.

FIG. 5 provides a schematic illustration of a third example alternativemethod of locating a sacrificial material 112 onto the sheet structuralmaterial 122 wherein a sheet of sacrificial material is adhered orbonded to the sheet of structural material. For example, this may occurusing diffusion bonding, ultrasonic bonding, or bonding via an adhesiveproperty of the sacrificial material itself.

FIG. 6 provides a schematic illustration of a fourth alternative methodof locating a sacrificial material onto the sheet structural materialwherein a sheet of sacrificial material 112 is adhered or bonded to thesheet of structural material 122 via an intermediate bonding or adhesionmaterial 113 which may be formed on a surface of one or both of thesheets to be bonded (not shown) or alternatively may be a sheet material(as shown) which is located between the other two sheets.

FIGS. 7A and 7B provide schematic illustrations of a potentialrelationship between a sheet of structural material 122, a body ofsacrificial material 112, and a support or base structure 161 that maybe used in some embodiments of the invention. FIG. 7A shows thematerials and base initially separated while FIG. 7B shows the materialsand base after being bought and held together (e.g. attached, bonded,vacuum held, or the like) wherein the sacrificial material is locatedbetween the structural material and the base. If the sacrificialmaterial and the base are not to be cut through, primary laser cuttingmust occur from the top side of the assembly as shown by the arrow 172in FIG. 7B. In some variations of this embodiment, a polymer basedbonding material may be located between the substrate and the bridgingSACMAT (e.g. copper, tin, iron).

FIGS. 8A and 8B provide schematic illustrations of a potentialrelationship between a sheet of structural material 122, a body ofsacrificial material 112, and support or base frame 162. FIG. 8A showsthe materials and frame initially separated while FIG. 8B shows thematerials and frame after being bought and held together and wherein thesheet of structural material is located between the frame and thesacrificial material which results in a need for primary laser cuttingto occur from the top side of the assembly as shown by the arrow 172 inFIG. 8B. In some variations of this embodiment, a polymer based bondingmaterial may be located between the frame and the sheet material.

FIGS. 9A and 9B provide schematic illustrations of another potentialrelationship between a sheet of structural material 122, a body ofsacrificial material 112, and a support or base frame 162. FIG. 9A showsthe materials and frame initially separated while FIG. 9B shows thematerials after being bought and held together wherein the sacrificialmaterial is located between the frame and the structural material basewhich results in a need for primary laser cutting to occur from the topside of the assembly as shown by the arrow 172 in FIG. 9B. In somevariations of this embodiment, a polymer based bonding material may belocated between the frame and the sheet material.

Other potential relationships between a sheet of structural material, abody of bridging sacrificial material, and a support or base frame orstructure are also possible. For example, a top or bottom frame may beused in combination with a frame only or solid support or base structurewhich is located on the opposite side of the materials. In still otheralternatives, as will be discussed hereafter, the relationships betweenthese elements may also involve additional intermediate materials orcapping materials. In some alternatives, sacrificial material may belocated on both sides of the sheet STRMAT wherein only one of theregions of sacrificial material may act as a bridging material or bothmay act, at least in part, as a bridging material.

Examples of Sheet and/or Layer Stacking Useful in Some MethodEmbodiments of the Invention

FIGS. 10A-10I provide nine example material stacking or depositionarrangements that may occur in some method embodiments when a solid baseis used to the support the bridging sacrificial material.

FIG. 10A provides a schematic illustration of a possible relationshipbetween a sheet of structural material 122, a bridging sacrificialmaterial 112, and a base 161 such that laser cutting will occur from theupper surface as shown by arrow 172 and a resulting structure, orplurality of structures, to be formed will include material from thesheet of structural material (after removal of the bridging sacrificialmaterial).

FIG. 10B provides a schematic illustration of a possible relationshipbetween a first sheet of structural material 122-1, a second sheet ofstructural material 122-2, a bridging sacrificial material 112, and abase 161 such that laser cutting will occur from the upper surface asshown by arrow 172 and a resulting structure, or plurality ofstructures, to be formed will include material from the first and secondsheets of structural material.

FIG. 10C provides a schematic illustration of a possible relationshipbetween a first sheet of structural material 122-1 to an Nth sheet ofstructural material 122-N, a bridging sacrificial material 112, and abase 161 such that laser cutting will occur from the upper surface asshown by arrow 172 and a resulting structure, or structures, willinclude material from the first to Nth sheets of structural material.

FIG. 10D provides a schematic illustration of a possible relationshipbetween extra-structural material in the form of one or moremulti-material layers 182 of structural and sacrificial material, asheet of structural material 122, bridging sacrificial material 112, anda base 161 wherein laser cutting will occur from the upper surface asshown by arrow 172 and a resulting structure, or plurality of structuresformed, can include not only the sheet structural material but also oneor more layers of overlying structural material and possiblyencapsulated sacrificial material which formed part of each of the oneor more multi-material layers of deposited material.

FIG. 10E provides a schematic illustration of another possiblerelationship between extra-structural material in the form of one ormore multi-material layers 182 of structural and sacrificial material, asheet of structural material 122, bridging sacrificial material 112, anda base wherein the relationship is different from that of FIG. 10D sincethe multi-material layers in FIG. 10E are located below the sheet ofstructural material as opposed to above it. To avoid cutting through thebase and the bridging sacrificial material the cutting direction is fromabove as shown by arrow 172.

FIG. 10F provides a schematic illustration of a possible relationshipbetween extra-structural material in the form of one or moremulti-material layers 182 of structural and sacrificial material, twosheets of structural material 122-1 and 122-2, bridging sacrificialmaterial 112, and a base 161 wherein laser cutting will occur from theupper surface as shown by arrow 172 and a resulting structure, orplurality of structures formed, can include not only one sheetstructural material but two sheet structural materials and also one ormore layers of intermediate structural material and possiblyencapsulated sacrificial material.

FIG. 10G provides a schematic illustration of a possible relationshipbetween one or more layers of a material 184 that are located betweensheets of structural material 122-1 and 122-2, bridging sacrificialmaterial 112, and a base 161 wherein laser cutting will occur from theupper surface as shown by arrow 172 and a resulting structure, orplurality of structures formed, can include not only two sheets ofstructural material but also material from the intermediate layer orlayers of material (e.g. to improve conductivity).

FIG. 10H provides a schematic illustration of a possible relationshipbetween two separate regions of one or more multi-material layers 182-1and 182-2 which are separated by a sheet of structural material 122,bridging sacrificial material 112, and a base 161 wherein laser cuttingwill occur from the upper surface as shown by arrow 172 and a resultingstructure, or plurality of structures, to be formed can include not onlythe sheet of structural material by one or more layers of depositedmaterial on both sides of the sheet. The double sided location ofdeposited material may be achieved in a number of different waysincluding direct deposition to each side simultaneously or separatelyfollowed by adhesion to a separately formed body of bridging sacrificialmaterial or direct deposition of bridging sacrificial material to asurface of one of the multi-material regions. Alternatively, transfer ofseparately formed multi-material layers to one or both sides of thesheet structural material can occur and then diffusion bonding or anadhesive based bonding can occur. In an alternative to this embodimentand the other FIG. 10 embodiments noted as using one or moremulti-material layers, the one or more multi-material layers may bereplaced by one or more single material layers or a combination ofsingle material and multi-material layers.

FIG. 10I provides a schematic illustration of a possible relationshipbetween a sheet of structural material 122, a bridging sacrificialmaterial 112-1, a capping sacrificial material 112-2, and a base 161such that laser cutting will occur from the upper surface as shown byarrow 172 through the capping sacrificial material into the structuralmaterial and possibly even partially or perhaps completely through thebridging sacrificial material and where the resulting structure, orplurality of structures, to be formed will include material from thesheet of structural material (after removal of both the bridgingsacrificial material and remaining regions of capping sacrificialmaterial). The capping sacrificial material of this embodiment may beapplied to the other embodiments set forth in FIGS. 10A-10I.

Other potential relationships between different types and differentnumbers of structural materials are possible. In some embodiments whereone material layer has been shown to exist, two or more, materialslayers may exist. In other some embodiments, additional sheet materialsmay be used. In still other variations, additional deposited materialsmay be used. In some embodiments various combinations of sheet STRMAT,multi-material regions, and other material regions may exist.

FIG. 11A-11J provide ten additional example material stacking ordeposition arrangements that may occur in some method embodiments when ahollow base frame is used as opposed to the solid base of FIGS. 10A-10Iwhich may allow laser cutting to occur from either above or below orboth depending on the relationship of any bridging SACMAT or SACMATs andstructural materials.

FIG. 11A shows a relationship between a sheet of structural material122, a bridging sacrificial material 112 and a frame 162 similar to thatshown in FIG. 9B wherein primary laser cutting will occur from the uppersurface as shown by arrow 172 and a resulting structure, or plurality ofstructures, to be formed will include only sheet structural material.

FIG. 11B shows a relationship between a sheet of structural material122, a bridging sacrificial material 112 and a frame 162 similar to thatshown in FIG. 8B wherein primary laser cutting will occur from the lowersurface as shown by arrow 172 and a resulting structure, or plurality ofstructures, to be formed will include only sheet structural material.

FIG. 11C shows a relationship between two sheets of structural material122-1 and 122-2, a bridging sacrificial material 112 and a frame 162which is opposite to that shown in FIG. 10B wherein primary lasercutting will occur from the lower surface as shown by arrow 172 and aresulting structure, or structures, to be formed will include materialfrom the two sheets of structural material. Of course in otheralternative embodiments, more than two sheets of structural material maybe used.

FIG. 11D shows a relationship between a sheet of structural material122, a region formed from one or more multi-material layers 182, abridging sacrificial material 112, and a frame 162 where the sheet ofstructural material is connected to the frame while one or moreoverlying multi-material layers are located above the sheet and a bodyof the bridging sacrificial material. In this embodiment, primary lasercutting occurs from the bottom so that the bridging sacrificial materialneed not be cut all the way through. In some variations of thisembodiment, and the other embodiments that contain multi-materiallayers, laser cutting of the multi-material layers may or may not beused to define the geometry of the structure since patterned depositionsof the multi-material layer materials may be used in whole, in part, ornot at all to set the geometry of the structural regions of themulti-material layers. In some alternative embodiments, the bridgingsacrificial material may be located below the lower sheet of structuralmaterial and mounted to the frame wherein primary laser cutting wouldoccur from the upper surface.

FIG. 11E depicts a relationship of materials similar to that of FIG. 11Dwith the exception that an additional sheet of structural material 122-2is located between the region of the multi-material layer(s) 182 and thebridging sacrificial material 112. In some alternative embodiments, thebridging sacrificial material may be located below the lower sheet ofstructural material and mounted to the frame wherein primary lasercutting would occur from the upper surface as opposed to the lowersurface as shown by arrow 172.

FIG. 11F shows a relationship where one or more layers of a material 184are located between two sheets of structural material 122-1 and 122-2,where a base frame 162 is located below the lower sheet and above theupper sheet is a body of bridging sacrificial material 112. In thisembodiment, primary laser cutting occurs from the bottom as shown byarrow 172. In some alternative embodiments, the bridging sacrificialmaterial may be located below the lower sheet of structural material andmounted to the frame wherein primary laser cutting would occur from theupper surface.

FIG. 11G shows a relationship where a single sheet of structuralmaterial 122 is bounded from above and partially from below by one ormore multi-material layers 182-1 and 182-2 and wherein the sheet is alsobounded, in part, from below around at least a portion of its peripheryby a base frame 162 while the lower one or more multi-materials layers182-1 is bounded from below by a region of bridging sacrificial material112. In this embodiment, both the upper and lower groups ofmulti-material layers may be formed directly on the sheet material andthen the bridging sacrificial material formed on the bottom of the lowermulti-material layer(s). Alternatively formation can occur separatelyand then transfer and bonding can be made to occur. In this embodiment,primary laser cutting occurs from above as shown by arrow 172. In somealternative embodiments, the upper portion of the frame could be mountedto the bottom of the lower multi-material region or the bottom of thebridging sacrificial material as opposed to the bottom of the sheet.

FIG. 11H shows a relationship where two sheets of structural material122-1 and 122-2 are used along with two multi-material layer regions182-1 and 182-2 along with a lower sacrificial bridging material 112 anda base frame 162. In this embodiment primary laser cutting occurs fromabove as shown by arrow 172. In this embodiment different bondingmethods are possible, e.g. direct deposition of the one or moremulti-material layers between the two sheets can occur partially on eachsheet and then bonding of the intermediate region made to occur, depositcan occur completely on one sheet and then bonding to the other sheetmade to occur, or deposition made to occur on one or more separatesubstrates and then transfer and bonding to both sheets made to occur.Similar possibilities exist for the bridging sacrificial material. Insome alternative embodiments the upper portion of the frame could bemounted to the bottom of the lower multi-material region or the bottomof the bridging sacrificial material as opposed to the bottom of thelower sheet.

FIG. 11I illustrates another example of a multi-region material stackwhere the stack includes, from top to bottom, a sheet structuralmaterial 122-3, a region formed from one or more multi-material layers182-2, a sheet structural material 122-2, a region formed from one ormore single material layers 184, a sheet of structural material 122-1, aregion formed from one or more multi-material layers 182-1, and abridging sacrificial material region 112. The stack as illustrated issupported by a frame 162 that bounds the bottom of the lower sheetstructural material. As shown by arrow 172 the primary cutting directionis from above. In some alternative embodiments the upper portion of theframe could be mounted to the bottom of the lower multi-material regionor the bottom of the bridging sacrificial material as opposed to thebottom of the lower sheet. In an alternative to this embodiment and theother FIG. 11 embodiments that are noted as using one or moremulti-material layers, the one or more multi-material layers may bereplaced by one or more single material layers or a combination ofsingle material and multi-material layers. Similarly, in otheralternatives, the single material layers as shown in this and the otherFIG. 11 examples may be replaced by one or more multi-material layers ora combination of one or more multi-material layers and one or moresingle material layers.

FIG. 11J provides a schematic illustration of a possible relationshipbetween a sheet of structural material 122, a bridging sacrificialmaterial 112-1, a capping sacrificial material 112-2, and a base frame162 such that laser cutting will occur from the upper surface as shownby arrow 172 through the capping sacrificial material into thestructural material and possibly even partially or perhaps completelythrough the bridging sacrificial material and where the resultingstructure, or plurality of structures, to be formed will includematerial from the sheet of structural material (after removal of boththe bridging sacrificial material and remaining regions of cappingsacrificial material). Of course the positions of the capping andbridging sacrificial material in this embodiment may be reversed alongwith the incident surface of the cutting laser beam. The cappingsacrificial material of this embodiment may be applied to the otherembodiments set forth in FIGS. 11A-10I.

FIGS. 12A and 12B illustrate that in embodiments like those shown inFIGS. 11A-11I, laser cutting can occur from both sides. Laser cuttingopposite the bridging sacrificial material may be used to cut outcomplete or partial outlines of the structures through the sheetmaterial and at least partially into the bridging sacrificial materialor into the one or more multi-material layers depending on whether thelaser is intending to cut completely through structural material on themulti-material layer(s). The laser cutting from the same side as thebridging sacrificial material may be used to cut or trim specializedfeatures in the sheet material or in the structural material of themulti-material layer(s), e.g. to trim down structure tips regions, orsimply to trim a portion of the outlines of the structures. FIG. 12Adoes not include any multi-material layers while FIG. 12B does.

Those of skill in the art will understand, from a review of theteachings herein, that numerous other material stacking possibilitiesexist such that structures may have enhanced material properties orfunctional properties that are provided by such stacking variations.Those of skill in the art will understand from the teachings herein thatlaser cutting or trimming, in some embodiments, may be used to providesubstantially all geometric features of the structures, while in otherembodiments, only a portion of the geometric features of a structure maybe defined by laser cutting or trimming while additional features may bedefined by providing selective placement of structural material andsacrificial materials, e.g. by photoresist based mask or direct writelithography, by selectively etching and removal of sacrificial materialand subsequent deposition of structural material, and/or byplanarization of sacrificial and structural materials. Those of skill inthe art will understand, upon review of the teachings herein, that lasercutting of structural material may occur in a single pass, multiplepasses, multiple partially overlapping passes, multiple cutting ortrimming operations that may directly follow one another or be separatedby deposition, planarization, bonding, or other non-laser cutting ortrimming operations. Those of skill in the art will understand, uponreview of the teachings herein that structures may become completelyisolated from one another (except for bridging supplied by the bridgingSACMAT) after laser cutting or that they may remain connected in somemanner via tethers of sheet structural material, tethers of otherstructural material, tethers of selectively located sacrificial materialuntil complete separation is desired (at which time cutting or otherremoval of tethers can occur). Those of skill in the art will understandfrom the teachings herein, that during laser cutting, the beam power,pulse width, wavelength, pulse duration, pulse repetition rate, beamorientation relative to the orientation of the material being cut mayvary to achieve different cutting effects.

It will be understood by those of skill in art that not every embodimentneeds to include a separately formed bridging sacrificial materialregion. In some alternative embodiments, no bridging sacrificialmaterial need be used. In some alternative embodiments, bridgingsacrificial material may be included as part of one or moremulti-material layers particularly where a multi-material layer that isnot cut completely through has structural features not defined by lasercutting but by patterned existence of structural material such thatthere is no need to cut completely through at least one of themulti-material layers and thus its sacrificial material may serve thefunction of the bridging sacrificial material.

Side View Configurations of Sample Structure Embodiments FormableAccording to Some Method Embodiments of the Invention

FIGS. 13A-15K depict side views of different embodiments of structuresformed from one or more layers of sheet material and in some embodimentsone or more layers of deposited material which may involve eithermultiple materials per layer (e.g. different materials located indifferent lateral regions of a single layer whose upper and lowerboundaries may be set by planarization) or a single material per layer.In some embodiments the structures may be compliant contact structures(e.g. probes) and may include a tip material having improved contactproperties relative to another material used in forming a body of thestructure which in turn may provide better spring properties. In someembodiments, improved material properties in one or more regions of astructure are obtained by modifying the material properties ofstructural materials. In some embodiments tip material may be limited tothe distal ends (right most sides in the figures) while in otherembodiments tip material may extend to base ends or proximal ends of thestructures (left most sides as illustrated). In some structures that areformed, embodiments may also include formation of regions containingother specialized materials such as materials that provide enhancedconductivity, materials that provide enhanced or more reliable bondingcapability to other structures, materials that provide enhanced or morereliable bonding or joining of different structural materials, materialsthat provide dielectric properties, and the like. In some embodiments,such specialized properties may be obtained by use of differentmaterials or by modification of existing materials.

FIG. 13A depicts a schematic representation of a side view of structureformed from a single sheet of structural material having a uniformthickness in Z (i.e. the direction perpendicular to the plane of thesheet material from which it was formed) from proximal to distal endsand having a desired material shape and configuration in the XY plane(e.g. bent or S-shaped—not shown other than as overall length).

FIG. 13B depicts a schematic representation of a side view of astructure formed form a single sheet of structural material where lasercutting was used to cut a desired configuration in the XY dimensions ofthe structure (not shown other than as overall length) and to trim downthe tip region from above and from below such that the tip has agenerally rectangular shape but is thinner than the sheet in thicknessin Z.

FIG. 13C depicts a schematic representation of a side view of astructure formed form a single sheet of structural material where lasercutting was used to cut a desired configuration in the XY dimensions(not shown other than as overall length) of the structure and to trimthe tip region from above or below at an angle such that the tip has agenerally triangular shape in a side view in the Z-dimension. The tipmay form a point, an elongated straight line, a curved line, a pluralityof points, or the like along its distal end as may be seen from a top orbottom view (not shown).

FIG. 13D depicts a schematic representation of a side view of astructure formed form a single sheet of structural material where lasercutting was used to cut a desired configuration in the XY dimensions ofthe structure and to trim the tip region from above or below at an anglesuch that the tip has a generally truncated triangular shape in a sideview while it may form a point, a line, a curved surface, a multi-pointsurface, or the like along its distal end in a top view (not shown).

FIG. 13E depicts a schematic representation of a side view of astructure formed form a single sheet of structural material where lasercutting was used to cut a desired configuration in the XY dimensions ofthe structure (not shown other than as overall length) and to trim thetip region from above, from below, from both above and below along oneor more non-perpendicular axes such that the shape of the tip isgenerally triangular with its peak located toward the central axis (inthe Z-dimension) and which may form a point, a blunt point, an elongatedconfiguration, a multi-tip configuration or some other configurationalong its distal end as may be seen from a top view or bottom view (notshown).

FIG. 13F depicts a schematic representation of a side view of astructure formed form a single sheet of structural material where lasercutting was used to cut a desired configuration in the XY dimensions ofthe structure (not shown other than as overall length) and to trim thetip region from above and below to form a thinned neck section and fromabove, below, or both along one or more non-perpendicular axes such thatthe shape of the tip that extends from the neck is generally triangularwith its peak located toward the central axis (in the Z-dimension) andwhich may form a blunt point, elongated configuration, or some otherconfiguration along its distal end as seen from a top or bottom view.

FIGS. 13G and 13H depict schematic representations of side views ofstructures formed form a single sheet of structural material where lasercutting was used to cut a desired configuration in the XY dimensions(not shown other than as overall length) of the structure to form tipslike that shown in FIG. 13F wherein additional laser trimming is used toform notches or narrowed regions at the proximal ends of the structures(e.g. left ends). In the case of FIG. 13G the notching or narrowing ofthe proximal end occurs along only the top of the structure while inFIG. 13H the notching or narrowing of the proximal end occurs along boththe top and bottom of the structure.

FIG. 13I depicts a schematic representation of a side view of astructure formed from two sheets of structural material, which may ormay not be of the same material, which have been bonded together andmachined such that the distal end of structure formed from one sheetextends further than the distal end formed from the other sheet. Theformation of the pattern shown in this figure may be achieved by bondingand then performing all laser cutting or by performing some lasercutting, then bonding, and then additional laser cutting.

FIG. 13J depicts a schematic representation of a side view of astructure similar to that of FIG. 13I with the exception that theretained portion of the upper sheet extends beyond the distal end of theretained portion of the lower sheet while the proximal and centralregions of the lower sheet are allowed to extend beyond that that of theupper sheet. Such a configuration may be obtained by trimming and/orcutting from both top and bottom of the sheets or may occur as notedwith regard to FIG. 13I by forming some openings before bonding andcompleting trimming and cutting after bonding.

FIG. 13K depicts a schematic representation of a side view of astructure formed from three sheets of structural material which havebeen bonded together with the retained part of the second sheetextending distally beyond the retained parts of the first and thirdsheets. Such configurations, as with FIGS. 13I and 13J may be formed ina variety of ways. Some feature formation (via laser cutting) may occurbefore bonding or all of it may occur after bonding. For example, holesover tip regions in the upper and lower sheets may be formed prior tobonding and then cutting of structure perimeters may occur through allthree sheets after bonding).

FIG. 13L depicts a schematic representation similar to that of FIG. 13Ewith the exception that a tip region (right most side of the structure)has been modified by a treatment to change its properties (e.g. it mayundergo heat treating or some other treatment such as a shallowcarburization, e.g. to a depth of 1 to 10 microns). In some alternativeembodiments, heat treatment or other treatments such as carburizationmay occur over the entire surface of the structure, over one or bothsurfaces of the sheet prior to laser cutting. In other embodiments, suchtreatment may be applied to a single sheet of a multi-sheet structure.

FIG. 14A provides a schematic representation of a side view of astructure similar to that of FIG. 13I with the exception that theregions of distally extending structural material 184 include depositedmaterial (i.e. second structural material, e.g. tip material) instead ofsheet material 122. The formation of such a structure may occur in avariety of ways. For example, formation may occur according to thefollowing steps: (1) before depositing the second structural material,form openings in the sheet material in regions that will be overlaid byextended second structural material, (2) deposit or otherwise locate asacrificial or fill material into the openings, (3) if needed, planarizethe sheet material and the sacrificial or fill material, (4) deposit thesecond structural material in a patterned or blanket manner, (5) cutoutthe structures using a cross-sectional pattern which may be based on aBoolean union of the structural areas of the sheet and the structuralarea of the second structural material or if the second structuralmaterial was deposited in a patterned manner, the laser cut regions maydeviate from an exact match in the tip region as the laser cutting ortrimming would not necessarily need to be used to define the tip region.In other variations, in addition to using Boolean operations to definelaser cutting areas, boundary offsetting may be used (e.g. based onincremental erosion algorithms or incremental expansion algorithms).

FIG. 14B provides a schematic illustration of a structure similar tothat of FIG. 14A with the exception that an intermediate layer 184-1 ofa deposited material is located between the sheet structural material112 and the second structural material 184-2. This intermediate material184-1 may be a third structural material or may be an adhesion layermaterial, a seed layer material, a barrier material (e.g. to limitdiffusion or migration between the sheet structural material and thesecond structural material) or a combination that provides for improvedadhesion, bonding, and/or integration of the sheet and second structuralmaterials.

FIG. 14C provides a schematic illustration of a structure according toanother embodiment wherein the second structural material (e.g. tipmaterial) 184 doesn't extend beyond the XY dimensions of the retainedsheet structural material but instead simply matches it but due to theharder tip material properties it is worn away more slowly during usesuch that it tends to protrude further than the retained sheet materialand thus provides a primary contact surface after being put to use andundergoing a relative small number of scrubbing contacts.

FIG. 14D provides a schematic illustration of a structure according toanother embodiment wherein a second structural material 184-1 isprovided on one side of the sheet material 122 while a third structuralmaterial 184-2 (which may be the same as or different from the secondstructural material) is provided on the other side of the sheetmaterial.

FIG. 14E provides a schematic illustration of a structure similar tothat of FIG. 13J with the exception that the second material 184 is adeposited material and the deposited material extends distally beyondthe sheet material 122. The formation of such a structure may occur in avariety of ways. For example blanket deposited second structuralmaterial may be cut (on the perimeter of the structure) by a laser andtrimmed down or removed by controlled depth ablation by a laser.Similarly the distal end of the sheet material may also be trimmed by alaser (e.g. ablating from below). In another implementation, the secondstructural material may be patterned deposited thus reducing the amountof laser trimming necessary. In still other implementations, patterneddeposition of the second structural material may occur after openingshave already been formed in the sheet material and filled with asacrificial material which a portion of the second structural materialwill overlay.

FIG. 14F provides a schematic illustration of a structure similar tothat of FIG. 14E with the exception that prior to deposition of thesecond structural material 184 a notch, e.g. a reentrant notch (asshown) or a notch with vertical side walls (not shown), may be lasermachined into selected portions of the sheet material 122 to provide foran interlocked volume of second structural material after deposition.

FIG. 14G provides a schematic representation of a side view of astructure formed from sheet of structural material 122 and a secondstructural material 184 which is deposited, in part, into a groove,slot, or channel cut into the retained portion of the sheet structuralmaterial.

FIG. 14H depicts a schematic representation of a side view of astructure formed from two sheets 122-1 and 122-2 with a notch in thelower sheet for holding a second structural material 184 (e.g. a tipmaterial) such that the two sheets of material provide at least partialentrapment of the second structural material.

FIG. 14I depicts a schematic representation of a side view of astructure formed from a single sheet of structural material 122 whichhas received a deposit of a second structural material 184 (e.g. a tipmaterial) around its distal end. Such a structure may be formed bycutting holes through the sheet material at distal end of the intendedstructure region or regions and there after selectively depositing thesecond structural material or blanket depositing it and then etchingaway material from regions that are supposed to be free of it.

FIG. 14J depicts a schematic representation of a side view of astructure formed from a single sheet of structural material 122 whichhas received a deposit of a second structural material 184 (e.g. a tipmaterial) around a large portion of, if not its entire, periphery. Insome variations of this probe, the coating material may be limited tothe top, bottom, distal, and proximal ends while in other variations thecoating material may also cover the sides of the sheet material as well.Formation of such a structure may occur by the method outlined abovewith regard to FIG. 14I if a through hole is made not just at the distalend but also at the proximal end of the structural region or regions.

FIG. 14K depicts a schematic representation of a side view of astructure formed from a sheet material 122 and a deposited material184-1 that covers the top and bottom faces as well as the distal end ofthe structure. Such coating features may be formed by forming a throughhole in the sheet material in the distal region of the part and thendepositing the material 184-1 onto the top and bottom surfaces such thatit plates into the through hole at the same time. After which bridgingand/or capping materials may be deposited if desired and then probeboundaries cut out. The laser cutting may or may not be used to definethe tip regions depending on how wide the through hole was and whetherthe deposited material completely filled the gap.

FIG. 14L is similar to that of FIG. 14K with the exception that a seconddeposited material 184-2 covers the first deposited material on the top,bottom, and distal end. A process of forming a structure like that ofFIG. 14L may be implemented similar to that noted for FIG. 14K with theexception that the deposition of the first deposited material 184-1 isfollowed by a deposition of the second deposited material 184-2.

FIG. 14M depicts a schematic representation of a side view of astructure formed from a sheet material 122 and a top and bottom coatingmaterial 184-1 that does not coat either the distal or proximal ends ofthe structure and a second coating material 184-2 that in addition tocoating the top and bottom surfaces also coats the distal end. A processfor forming such a configuration may involve deposition of material184-1 on the top and bottom surfaces, followed by laser ablation of thesheet material in the distal end region to form a through hole, and thendeposition of the second deposited material 184-2. After deposition ofthe second material further laser cutting may be performed to define theperimeter of the structure or structures being formed.

FIG. 14N depicts a schematic representation of a side view of astructure formed from a sheet material 122 and two coating of material184-1 and 184-2. The deposition of the coating materials may occur aftertrimming down the distal or tip region and forming a through hole.

FIG. 14O depicts a structure similar to that of FIG. 14N with theexception that the 2^(nd) coating material 184-2 only occupies thedistal region around the first coating material 184-1. A first coatingmay be formed in a manner similar to that discussed above with regard toFIGS. 14I-14N and thereafter either selectively depositing the secondcoating to the distal region or blanket depositing it to both sides andthen planarizing both sides to remove the second coating material fromthe side regions.

FIG. 14P depicts a structure similar to that of FIG. 14M but with atrimmed down tip region. The structure of FIG. 14P may be formed in amanner similar to that of FIG. 14M with the exception that instead offorming a simple through hole, the tip region is trimmed down from bothtop and bottom and a through hole is formed adjacent to the trimmed downregion after which the coating of material 184-2 occurs.

FIG. 14Q depicts a schematic representation of a side view of astructure formed from three sheets of structural material 122-1, 122-2,and 122-3 with a deposition of a second structural material 184 (e.g. atip material) in a recess within the second sheet 122-2.

FIG. 15A depicts a schematic representation of a side view of astructure formed from a single sheet of structural material 122 with anupper region formed from one or more multi-material layers 182 ofdeposited materials including a tip region formed from a thirdstructural material 184 that may be different than a structural materialforming other parts of the multi-material layer(s).

FIG. 15B depicts a schematic representation of a side view of astructure formed from two sheets of structural material 122-1 and 122-2with central region formed from one or more multi-material layers 182 ofdeposited materials including a tip region formed from a thirdstructural material 184 (e.g. a tip material) that may be different thana structural material forming other parts of the multi-materiallayer(s).

FIG. 15C depicts a schematic representation of a side view of astructure formed from two sheets of structural material 122-1 and 122-2with central region formed from one or more multi-material layers 182 ofdeposited materials including a tip region that is formed from a thirdstructural material 184, which may be the same or different from astructural material forming other parts of the multi-material layers andwhich is thinner than the thickness of the multi-material region.

FIG. 15D depicts a schematic representation of a side view of astructure formed from two sheets of structural material 122-1 and 122-2with central region formed from one or more multi-material layers 182 ofdeposited materials including (1) a tip region formed from a thirdstructural material 184 that may be different from a structural materialforming other parts of the multi-material layer(s) and (2) a central orinternal region formed of a core material 186 that has a higherconductivity than a surrounding shell material.

FIG. 15E depicts a schematic representation of a side view of astructure formed from two sheets of structural material 122-1 and 122-2with central region formed from one or more multi-material layers 182 ofdeposited materials including (1) a tip region formed from a thirdstructural material 184 that may be different from a structural materialforming others part of the multi-material layer(s) and (2) a centralregion having an up-facing core material 186 that is surrounded on thesides and bottom by a shell material.

FIG. 15F depicts a schematic representation of a side view of astructure formed from two sheets of structural material 122-1 and 122-2with central region formed from one or more multi-material layers 182 ofdeposited materials including (1) a tip region that is thinner than theheight of the central region and formed from a third structural material184 that may be different from a structural material used in formingother parts of the multi-material layer(s) and (2) a core region formedof a core material 186 that may have a higher conductivity than asurrounding shell material.

FIG. 15G depicts a schematic representation of a side view of astructure formed from two multi-material single or multi-layer regions182-1 and 182-2 separated by a central region formed from at least onesheet of structural material 122 and a tip material 184 that extendsbeyond the distal ends of the multi-material regions.

FIG. 15H depicts a schematic representation of a side view of astructure formed from two multi-material single or multi-layer regions182-1 and 182-2 separated by a central region formed from at least onesheet of structural material 122 with a plurality of holes extendingthrough it and a tip material 184 that extends beyond the distal ends ofthe multi-material regions. Due to the presence of the holes extendingthrough the central sheet region, some of the material deposited inassociation one or both of the multi-material regions penetrates intothe openings in the sheet such that a continuous volume of depositedstructural material extends from the lower to upper surface of thestructure.

FIG. 15I depicts a schematic representation of a cut side view of astructure formed similar to that of FIG. 15H but the at least onedeposited structural material forming a portion of the top and bottommulti-material regions 182-1 and 182-2 (in the Z-direction) extendsthrough holes in the sheet material 122 and also surrounds at least partof the sides of the sheet material (not shown in the cut side view ofFIG. 15I).

FIG. 15J depicts a schematic representation of the a side view of astructure formed similar to that of FIG. 15G with the exception that theformation of multi-material layer or layers forming the regions 182-1and 182-2 on the top and bottom of the structure result in encapsulationof a core or internal structural material 186 by a shell of externalstructural material.

FIG. 15K depicts a schematic representation of the a side view of astructure formed from (1) three sheets of structural material 122-1,122-2, and 122-3, (2) two intermediate regions of single or multi-layer,multi-material deposition regions 182-1 and 182-2 including two tipmaterial regions 184-1 and 184-2 located at the distal ends of themulti-material deposition regions.

Numerous alternative to the configuration embodiments of FIGS. 15A-15Kare possible. For example, where the individual FIGS illustrate theexistence of regions formed from one or more multi-material layers, theregions may instead be formed from one or more single material layers ora combination of single and multi-material layers.

ADDITIONAL METHOD EMBODIMENTS OF THE INVENTION

Structures similar to that of FIG. 13A may be formed according to stepsof Method Embodiment 1 wherein the laser beam incident angle is normalto the surface of the sheet of structural material.

Structures similar to that of FIG. 13B may be formed in a varietyaccording to a modified version of method of Embodiment 1 wherein inaddition to cutting out the XY perimeters of the structures, ablationfrom above and below are used to narrow a region of the structure (e.g.a tip region of the structure. As shown in FIG. 16A, such narrowing fromthe back side may occur by ablating away a backside bridging SACMAT inthe narrowed region. An alternative process for producing the structureof 13B is shown in FIG. 16B wherein a capping layer is provided inaddition to the sheet structural material and the bridging structuralmaterial and wherein an example of cutting order is shown by the circlednumbers. In some implementations the region requiring vertical narrowingmay be relatively small laterally compared to the length of thestructure but it may be relatively wide laterally compared to a width ofthe structures so that a single opening or set of trimmed down top andbottom regions may provide tips regions for a plurality of probes formedside by side. Alternatively such narrowing may occur before mounting ordepositing a bridging SACMAT to the back side of the sheet structuralmaterial. Such narrowing of the selected regions of the back side mayoccur before, after or simultaneously with the cutting from the frontside.

Structures similar to that of FIG. 13C may be formed in a variety ofways. All or most of the perimeter of the structure may be cut to adepth that penetrates into the bridging SACMAT using a beam with normalincidence from the top. The tapering of the tip region may be cut, fromthe top with an angled incidence and at a depth that provides for thedesired tip angle. Such cuts are illustrated in FIG. 17 with a possibleorder of cutting shown by the circled numbers. Alternatively cutting ofthe tapering region may occur from the bottom.

Structures similar to that of FIG. 13D may be formed in a variety ofways. Most of the perimeter of the structure may be cut to a depth thatpenetrates into the bridging SACMAT and if the perimeter includes thedistal extreme of the tip region all of the perimeter may be cut using abeam with normal incidence from the top wherein the cutting depth wouldresult in complete cutting through the sheet STRMAT but only part wayinto the bridging SACMAT. The tapering tip region may be cut from thetop with an offset but angled incidence and at a depth that provides forthe desired cutting depth. Such cuts are illustrated in FIG. 18A. In analternative implementation, cutting along the angled path may occurbefore cutting along the vertical paths. However, in a most preferredimplementation, to avoid a potentially small region located between thevertical and angled cuts from becoming displaced and possibly causingdisruption of the cutting beam path and to avoid the cutting pathunintentionally encountering a void region, ablation along the verticalpaths can occur before ablation along the angled paths and ablation ofthe intermediate region can occur prior to cutting along the angled pathas shown in FIG. 18B by the circled numbers showing the order ofcutting.

Structures similar to that of FIG. 13E may be formed in a variety ofways. Most of the perimeter of the structure may be cut to a depth thatpenetrates into the bridging SACMAT and if the perimeter includes thedistal extreme of the tip region all of the perimeter may be cut using abeam with normal incidence from the top wherein the cutting depth wouldresult in complete cutting through the sheet STRMAT but possibly onlypart way into the bridging SACMAT. The upward part of the tip region maybe cut from above by a beam angled to the right while the lower half ofthe tip region may be cut from above by a beam angled to the left as canbe seen in FIG. 19A wherein a possible order of cutting is shown by thecircled numbers. Alternatively, the lower portion of the tip region maybe cut from the bottom with a right facing beam directed through anybridging SACMAT and through the sheet STRMAT. In another alternative,the angled tip region may not be initially cut by a normally alignedbeam. In still another alternative the cutting order may be changed. Ineven a further alternative, a small region between the angled cuts maybe ablated before performing the angled cuts so that its displacementduring cutting or variations in cutting depth do not provideunanticipated cutting or ablation of the intended structure as shown inFIG. 19B with the circled numbers showing the order of cutting.

Structures similar to that of FIGS. 13F-13G may be formed in a varietyof ways. For example, a combination of the methods used for forming thestructure of FIGS. 13B and 13E may be used.

Structures similar to that of FIGS. 13I and 13J may be formed in avariety of ways. Modifying extents of the structural regions of eachsheet (as necessary) may occur by laser cutting or ablation of theopenings in one sheet in regions where the other sheet has extendeddimensions (where the extension will occur) before bonding the twosheets together followed by the cutting out of the perimeter from bothsheets after bonding. Alternatively, cutting of the perimeter andtrimming down may both occur after bonding using varied laser cutting orablation parameters wherein the ablation of the lower sheet material inthe tip region can occur using a beam that is incident from below whileablation of the upper sheet (as is necessary in the structure of FIG.13J) can occur from above.

Structures similar to FIG. 13K can be formed using slightly modifiedversions of the methods noted for FIGS. 13I and 13J. For exampleopenings may be formed in one or both the top and bottom sheet prior tobonding in regions where the tip will be located. After bonding,perimeter cutting and any additional laser trimming may be performed.Alternatively complete formation may occur after bonding by performingnecessary perimeter cutting and ablations of both top and bottom sheetsto form appropriate structural steps.

Structures similar to that of FIG. 13L may be formed in a variety ofways. Such structures may be formed using a method similar to that notedabove with regard to FIG. 13E wherein after formation, tips or entirestructures may be coated with a treatment material (e.g. carbon black)and then the tip regions or entire structures subject to heating at asufficient level and in an appropriate atmosphere to allow creation of ashell of modified material (e.g. tungsten carbide) on the surface of thestructure or on selected portions of the surface. Alternatively, tipsregions may be trimmed down to form pockets on one or both sides, atreatment material may be applied to the pocket regions in the sheetwith treatment material made to undergo modification processing. Afterthe modification is complete, any additional laser processing may becompleted. In some treatment steps, in this embodiment and in otherembodiments set forth herein heating may be performed in a variety ofmanners including via oven heating, induction heating, laser beamheating, or the like. Some treatments may not involve a treatmentmaterial but simply a heating and/or cooling process potentially in acontrolled atmosphere.

FIGS. 14A-15K illustrate structures formed from a combination of a sheetmaterial and a deposited structural material and perhaps a depositedsacrificial material that may be different from any bridging sacrificialmaterial that is used. Such structures may be formed by a variety ofmethods which may involve some elements of the first method embodiment,some elements of the methods discussed above in association with theformation of the structures of FIGS. 13A-13L, and the steps discussedabove with regard to FIG. 10. Some methods may involves variations inthe order of combining one or more sheets of sheet STRMAT, one or moreregions of deposited single material or multi-material layers, or one ormore layers of bridging SACMAT. Some embodiments may vary when lasermachining will be performed relative to the stacking of sheets, layers,regions or bridging SACMAT. Some embodiments may vary how structuralmaterial regions are defined, e.g. only by laser cutting and areaablation, by a combination of laser cutting and area ablation along withselective placement of structural materials. Some embodiments, likethose of FIGS. 14J-14P may involve depositions of conformal coatingsthat coat top and bottom surfaces or shaped tip regions and which mayalso involve formation of through holes into which such coating may bedeposited.

FIGS. 20A and 20B respectively provide a block diagram of major processsteps and corresponding side cut views of various states of a process,as applied to the creation of an example structure, according anothermethod embodiment of the invention wherein a plurality of structures areformed from a sheet of structural material and a single region formed ofone or more layers with each layer formed from a single material orformed from multiple materials wherein the process forms the single ormulti-material region on a bridging SACMAT which in turn may be on asubstrate (not shown) and after which bonding of the single ormulti-material region to a sheet STRMAT occurs.

FIGS. 21A and 21B respectively provide a block diagram of major processsteps and corresponding side cut views of various states of a process,as applied to the creation of an example structure, according anothermethod embodiment of the invention wherein a plurality of structures areformed from a sheet of structural material and a single region formed ofone or more layers with each layer formed from a single material orformed from multiple materials wherein the process forms the single ormulti-material region on a sheet STRMAT (with or without first providingan adhesion layer and/or a seed layer) and then the process attaches thesingle material region or the multi-material region to a bridging SACMATor deposits the bridging SACMAT on to such a region.

FIGS. 22A and 22B respectively provide a block diagram of major processsteps and corresponding side cut views of various states of a furthertwo processes of forming an example structure according another methodembodiment of the invention wherein a plurality of structures are formedfrom a sheet of structural material and a single region formed of one ormore layers with each layer formed from a single material or formed frommultiple materials wherein the process provides a sheet of SRTMAT on towhich either bridging SACMAT is deposited or bonded or on to which asingle material or multi-material region is deposited or bonded afterwhich the other of the bridging SACMAT or the single material ormulti-material regions is deposited or bonded to the other side of thesheet STRMAT.

Numerous further alternatives to the embodiments of FIGS. 20A-22B exist.For example, like in FIGS. 16-19B angled cutting, bottom and topcutting, and trimming may be used to provide more complex structuressuch as those shown in FIGS. 14A, 14B, 14E-14G, and 15A. In stillfurther variations, additional single material regions or multi-materialregions may be bonded or formed on the sheet STRMAT or one or moreadditional sheets of STRMAT may be bonded to existing sheets of STRMATor to existing single material or multi-material deposited layers suchthat the structural embodiments of FIGS. 14D, 14H, 14K, and 15B-15Kcould be formed. In some embodiments, depending on the XY configurationof the structures, the XY configuration of individual sheets ordeposited materials, the order of laser cutting and sheet/layer adhesionor build up, laser cutting may be used to define all geometric featuresof a structure or some geometric features may be defined by thepatterned configurations of structural materials deposited onmulti-material layers.

FIGS. 23A and 23B respectively provide a block diagram of major processsteps and corresponding side cut views of various states of a processapplied to the creation of an example structure according to anothermethod embodiment of the invention wherein a plurality of structures areformed from a sheet of structural material and from two regions with oneon either side of the sheet and with each formed of one or more layersand with each layer formed from a single material or formed frommultiple materials. The regions on either side of the sheet may beformed with or without a first providing an adhesion layer and/or a seedlayer on the sheet material depending on the materials involved and thedeposition methods to be used. After creating the regions on the sheetmaterial, the process then forms on or attaches bridging SACMAT andCAPPING SACMAT to the regions. After this laser cutting can occur. Insome variations of this process, both the single material ormulti-material regions and the sacrificial material on one side of thesheet may be formed before forming the equivalent elements on the otherside of the sheet.

Brief descriptions of methods for forming structures having the featuresof FIGS. 14J-14P were set forth above. The following process, asillustrated with the aid of FIGS. 24A-24P, provides a more detaileddescription of the steps of another embodiment that can be used to formstructures like those of FIGS. 14J-14P as well other structures. Inother words the process of the next embodiment of the invention providesfor forming structures from a sheet material with at least one coatingof material on each side and around the tip (e.g. the coating materialmay be, for example, a conductivity enhancer, a bonding material, or atip material, or all of these). In some variations, the process mayprovide for one or more coating materials around not only a distal tipregion but also a proximal base or secondary tip region.

Step 1 of the process (as illustrated in 24A) includes supplying atleast one foil or sheet material 201 (e.g. tungsten, molybdenum,platinum, palladium, or the like) that may or may not be held by aframe. If multiple sheets are supplied they may be bonded together orpressed together for later bonding. They may be separated by one or moreintermediate materials (e.g. bonding materials). The sheets or sheets asa whole have a top surface 201T and bottom surface 201B as well as sidesurfaces 201S.

Step 2 of the process (as illustrated in FIG. 24B) includes optionallysputtering an adhesion promoter 202T and 202B (e.g. copper, tin, iron,gold, silver) on both faces (e.g. top and bottom) to a thickness of,e.g., 100-800 nm. This may be done one face at a time or both facessimultaneously.

Step 3 of the process (as illustrated in FIG. 24C) includes plating asacrificial protective coating 205B and 205T over both sides of the foilmaterial (e.g. copper, tin, or iron, via electroplating) to a thicknessof, e.g., 5-50 microns on both sides. This may be done one face at atime, both faces simultaneously, or both faces in part simultaneouslywith extra deposition going onto one face. The deposition thickness maybe the same for both faces or the deposition for one face may bedifferent than that of the other (e.g. the back side 201B may besupplied with thicker coating 205B). The thicknesses may for example inthe range of 5-50 ums, and more preferably in the range of 10-30 ums.The sacrificial material on one side may function as a bridging materialwhile that on the other side may function as a capping material. Inembodiments where cutting may occur from both sides, each sacrificialmaterial may play dual roles.

Step 4 of the process includes cutting completely through the foil, toform holes 207, in regions where one or more deposited materials areintended to cap not only the faces of the sheets but completely arounddistal and/or proximal ends of the structure. These regions may definedistal regions (e.g. tip regions) or proximal regions (e.g. bondingregions) for example. Such holes are illustrated in the cut side viewand top view of FIG. 24D. Holes 207 are shown having edges where partsof structures will be formed. Locations 208D represent edges of holesthat will define distal regions of structures that will be formed ofsheet material while 208P define proximal regions of structures the willbe formed of the sheet material. In some structures only one such regionmay exist while in others two or more such regions may exist. Theseholes may be considered through holes as they go completely through theexisting structural material though they may or may not extend completedthrough the bottom sacrificial material. Such holes may be madeindividually for each probe but to increase the number of probes thatmay be formed simultaneously (i.e. to improve packing density of theprobes during formation) it may be desirable to form openings that canaccommodate a plurality of probes. For example, each opening may definethe end location of the foil material for 2-100 probes locatedside-by-side. In some implementations some holes, as in the presentexample, may define the proximal end of one or more structures and thedistal end of one or more other structures. The through-hole length maybe dictated in part by the configuration and layout of the probes it mayalso be dictated by the requirement that the foil retain structuralintegrity and dimensionality through the fabrication process. In somecases the through holes may simply be rectangular slots which result inprobes having flat tip ends that are either perpendicular to their probebodies or are otherwise angled relative to their probe bodies dependingon the eventual orientation of probe bodies relative to the throughholes. In other embodiments, probe tips may take on curvedconfigurations, center pointed configurations, multi-pointconfigurations or the like depending on the shape of the through holesand the alignment/orientation of the holes relative to the probes bodiesthat will be laser cut in a subsequent step. The cutting to form throughholes may be by scanned laser cutting, by a physical cutting bit(particularly if the through holes represent rectangular openings), bywater jet, by EDM, or the like. In some embodiments, cutting of suchholes may be accompanied by the formation of fiducially marks oralignment marks for us in subsequent operations that require alignedpositions relative to earlier operations.

Step 5 of the process includes, after, or prior to, the cutting of thethrough holes, optionally laser trimming adjacent to the through holelocations from one or both sides of the sheet to provide thinned regionsof foil which can be used to define narrowed or thinned structuralfeatures such as probe tips, narrowed mounting locations, narrowedmounting location stop ledges. This option is illustrated in the sideview of FIG. 24E where distal regions are shown with two sided (i.e. topand bottom narrowing) while proximal regions are shown with one sidednarrowing (i.e. bottom only in this example).

Step 6 of the process is optional and may be done in addition to orinstead of step 5. It provides for optional laser trimming to form othernarrowed regions in the foil which may form recesses in the probe bodiesthat may eventually receive subsequently deposited materials or remaindeposit free. These recesses may form groves in probe bodies that can beused, for example, to modify the stiffness of the probe bodies or act asanchor locations for other materials to be subsequently deposited. Thisis illustrate in the side view of FIG. 24F wherein an intermediateregion (i.e. between the proximal and distal ends is shown with anelongated narrowing on the top and a puncture or drill like narrowing onthe bottom.

Step 7 of the process calls for the etching away of the top and bottomsacrificial materials from the foil or sheet and possibly the adhesionmaterial or other coating materials as well. FIG. 24G illustrates theresult of this step as applied to the example of FIG. 24D (i.e. as ifthe operations of FIGS. 24E and 24F didn't happen).

Step 8 of the process, after a possible cleaning and possible activationof the foil material, calls for a sputtering of a first adhesionmaterial onto the surface of both sides of the foil and into thethrough-hole regions. This sputtering may provide a coating thickness,for example, in the range of 200 nm (nanometers) to 1 um (micron ormicrometer). This coating material may for example be copper, gold,nickel-cobalt, or some other material that may act as a plating base fordeposition of additional material. The result of this step isillustrated in FIG. 24H wherein material 201 is coated with material212.

Step 9 of the process calls for depositing a first coating of material,e.g. by electrodeposition, over both surfaces of the foil and into thethrough hole region. This deposition may occur directly on the sputteredmaterial or it may occur on a material that was deposited by a strike.This material may for example be a high conductivity material such assilver, gold or even copper depending on the sacrificial material thatwill be used in a subsequent step. As another example this coatingmaterial may be a contact or tip material such as rhodium or rhenium.This coating may be deposited to any appropriate thickness, e.g. from 1um to 20 um or more. For example gold may be plated in the 3-8 ums rangeto provide a good conductivity enhancement over a foil of tungsten whilerhodium may be deposited to a thickness of 2-6 ums to provide a goodcontact surface. The result of this step is shown in the cut side viewof FIG. 24I with the first coating material 222 (i.e. the material ofthis step) being shown along with the adhesion promoter 212.

Step 10 of the process optionally calls for depositing a second coatingof a different material onto the first coating on both sides of the foiland into the through-hole region. For example if the first coating wasof a material to promote conductivity the second material may be acontact tip material. Alternatively, if the first coating were of acontact material, the second coating could be of a conductivity enhanceror material that promotes solderability or bonding in some other manner.In some circumstances it may be appropriate for the second material tonot be the contact material and the contact material to be hiddenthereunder particularly if the second coating material will wear offquickly under one or more preliminary contacts leaving behind a materialthat provides good physical/electrical contact in combination with goodwear resistance. The thickness of this second coating can also be of anyappropriate amount, e.g. from 1 um to 20 um or more. The result of thisstep is shown in the cut side view of FIG. 24J with the second coatingmaterial 232 being shown along with the first coating material 222 (i.e.the material of this step) and the adhesion promoter 212.

Step 11 of the process optionally calls for the depositing of anyadditional materials may be made.

Step 12 of the process calls for depositing a sacrificial material (e.g.tin, iron, or copper) on both sides of the foil and into thethrough-hole region. Deposition may or may not occur on along thesidewall perimeter of the foil or sheet. This sacrificial material mayact as a capping or splatter barrier on the front side of the foil and abridging and/heat sink material on the backside of the foil. If cuttingis to occur from both sides of the coated foil, both sides may provide acapping or splatter barrier as well as in some regions of the build abridging material. If laser cutting is to occur from both sides, in someimplementations the backside sacrificial material may act as an initialbridging material while the front side is cut, then a front side depositof additional sacrificial material may occur so it can act as a bridgingmaterial while back side cutting occurs. This result of this depositingof material 242 is shown in FIG. 24K.

Step 13 of the process calls for the optional mounting of the backsideof the coated foil to a substrate 244 which may occur for example via anadhesive 243, e.g. a polymer adhesive, prior to performing front sidelaser cutting. In an alternative implementation mounting to a poroussubstrate or substrate with slots or other openings may occur viaelectroplating sacrificial material 245 while the coated foil andsubstrate are pressed together. This first example is illustrated inFIG. 24L while the second is illustrated in FIGS. 24M and 24N usingsubstrates 244 with different shaped hole patterns. The substrate ofFIG. 24M has vertical holes with narrowed top openings while thesubstrate of FIG. 24N has holes with tapered slots or conical holes attheir upper most extents.

Step 14 of the process calls for performing front side laser cuttingwhereby the structural materials are completely cut through (includingcutting through the front side deposited structural material ormaterials, the sheet material, and the backside deposited structuralmaterial or materials without cutting completely through the backsidesacrificial material. The laser may or may not cut along the distal endof the tip region where the through-hole was located or proximal endregion if a through-hole was located there as such regions are onlybounded by sacrificial material which will be removed later in theprocess anyway. So if the boundary defined by the sacrificial materialis acceptable tip regions need not be laser cut; however, if suchsacrificial material boundaries are not considered acceptable then lasercutting of distal or proximal regions can occur. This cutting isillustrated in the top view of FIG. 24O where 242 represents thedeposited sacrificial material, 257 represents locations where thoseportions of holes 207 were not filled in by deposits of structuralmaterial but instead were filled in only by the sacrificial material andthus do not necessarily require laser cutting to separate the parts, 251represents laser cutting paths and 253 represents the lateral locationsof parts (e.g. probes).

Step 15 calls for the optional mounting of the cut, coated foil to afront side substrate and releasing the cut, coated foil from the backside substrate. This mounting may be achieved in much the same manner asnoted above for step 13. Precautions may be taken to ensure that releaseof the original substrate does result in excess removal of back sidesacrificial material; however, if excess back side removal does occur,deposit of additional sacrificial material to the back side can occur.Such additional deposition, as with other deposition noted herein may befollowed by optional planarization to smooth the surface, set a desiredorientation for the surface, and/or set a net or known thickness for thedeposit.

Step 16 optionally calls for the cutting of the structure boundariesfrom the back side either to complete the process of cutting through thesides of the structures or to clean up the cuts made from the other side(e.g. to improve wall to face perpendicularity, i.e. to remove slopedside walls or to improve top to bottom and bottom to top symmetry. Asnoted previously herein, appropriate alignment steps may be taken toensure adequate registration of laser cutting regions.

Step 17 calls for the optional release of the cut, coated foil from thefront side substrate. This may occur by melting or dissolving of apolymer bonding material, etching of a metal sacrificial material likethat filling the openings of FIGS. 24M and 24N.

Step 18 calls for the optional performing of a good part/bad partdisambiguation process. This, for example, may take the form of the oneof the processes described in U.S. patent application Ser. No.14/043,670, filed Oct. 1, 2013, entitled a “Multi-Layer, Multi-MaterialMicro-Scale and Millimeter-Scale Batch Part Fabrication MethodsIncluding Disambiguation of Good Parts and Defective Parts” by Duy Le,et al. which is incorporated herein by reference.

Step 19 calls for the releasing of the plurality of formed probes fromthe sacrificial material. This may involve releasing all probessimultaneously, or releasing good or non-failed probes separately frombad or failed probes. FIG. 24P shows a top view, a side view, and an endview of an example structure formed by the layer stacking and cutting ofthis embodiment.

Numerous additional variations of this process exist. One set ofvariations includes planarizing one or more of the materials afterdeposition to either set a desired level of planarity and/or to set adesired net deposition thickness. Such planarization may be particularlyuseful if multi-material layers are to be formed.

Another set of variations involves performing one of more of thedepositions as selective depositions or at least as effective selectivedepositions (after planarization) as opposed to as blanket depositions.This may allow, for example, tip material to only be located inproximity to a tip as opposed to be located along the entire length ofthe probe or bonding material to only be located in a bonding region asopposed to along the entire length of the probe. In these variations itis possible to provide some form of masking prior to performing one ormore depositions to allow selective depositions to occur. This maskingmay be in the form of depositing or applying liquid or dry filmphotoresist, exposing the photoresist, and then developing thephotoresist; depositing or applying a dielectric and then direct writingpatterns into the dielectric using a laser beam; use of masking, dicing,or other adhesive tape; or direct and selective deposition of adielectric material via inkjet, computer controlled extruder, or thelike. If a hard to adhere material, e.g. Rhodium, is to be plated, onemight selectively deposit a thin adhesion promotion layer (e.g. copper)then blanket deposit rhodium into voids and then planarize the resultingdepositions.

Some implementations may involve use of strike depositions (e.g. acidbased strikes) after sputtering but before electroplating to provideenhanced activation of the surface.

Some implementations may involve the use of cleaning solutions andprocesses after laser cutting to ensure removal of debris. Some suchcleaning solutions may involve use of an acid based copper cleaningsolution that includes surfactants to loosen debris. Some such cleaningprocesses may involve the use of ultrasonic vibrations to aid in debrisremoval.

Some implementations may involve use of acid based etchants includingoxidizing agents (e.g. nitrate, peroxide, perosulfates, and the like(e.g. when the sacrificial material includes copper and an exposedstructural material includes tungsten).

Some implementations may perform laser cutting from both sides and thusmay benefit from the formation of a number of bore holes that extendcompletely through the sheet material and deposited material. Such holesmay be used as positioning, orientation, and scaling marks forpredictive laser beam positioning when switching laser cutting from oneside to the other side. Such implementation may use image recognition,targeting, and/or position weighting algorithms to provide highresolution determination of relative hole locations so that final lasercutting parameters may be derived from a combination of drawing patterndata that is scaled, translated, and or rotated based on front side toback side hole location determinations. In some variations the holesneed not be circular but instead may take on any other useful geometricform such as L shapes, cross-shapes, and the like. In some variationsthe bore holes may be associated with boundary regions of specificstructures (e.g. probes) or they may be independent features but with aknown geometric relationship to the part locations.

In some implementations, structures may be held in place by a bridgingsacrificial material until that bridging sacrificial material iscompletely cut through or until the bridging sacrificial material isetched away. In some embodiments, even after removal of the sacrificialbridging material, probes may still be held in their relative positionsby structural material tethering elements made of the sheet material,structural material tethering elements made of a deposited material,sacrificial material tethering elements made from a second sacrificialmaterial that is not etched by the etchant that removed the bridgingsacrificial material, or by the remaining sacrificial materialunderlying the parts being bonded to a working subtract that has notbeen cut through. Tethers may be useful for allowing post laser cuttingprocesses to occur to make enhanced probes, e.g. to allow blanket orselective deposition of one or more additional structural materials onone or both sides of a probe or on selected edge locations. Ifstructural material tethers are used, they will need to be cut away(e.g. via laser cutting or mechanical cutting) to release the structuresbut if a second sacrificial material is used as a tethering element,release of the structures may occur by etching with a second etchantwhich may reduce fabrication time and/or improve yield, shipment ofdefective parts, as it removes the need for alignment correlations andrisk of probe damage occurring by a misdirected cutting tool.

In some variations of the process, steps 4-6 may follow one or moredepositions of steps 8-11 as opposed to preceding these steps afterwhich at least one additional deposition could occur. Such a processvariation could result in some material not coating through-holes butonly the faces while another material coats not only the faces but thethrough holes as well. In still other variations, masking may be appliedto one or both of the surfaces prior to making some deposits so thatthose deposits don't coat the entire surfaces but only portions of them.This, for example, could result in tip material being constrained to tipregions, bonding material being constrained to bonding regions, or tocause a selected material to be deposited not only to both faces butalso in some wrap around regions.

FIGS. 25A-250L illustrate states of a process according to anotherembodiment of the invention wherein a foil is coated with a first topand first bottom structural material, which are coated respectively witha second top and a second bottom structural material, with the secondtop structural material coated with a capping material and the secondbottom structural material coated with bridging material and where afterproviding all the structural and sacrificial material layers, lasermachining (e.g. cutting) occurs to pattern the perimeters of thestructures being formed.

The process begins with the supplying of a sheet or foil of structuralmaterial 300 as shown in the cut side view of FIG. 25A. The sheetmaterial may be in the form of a single sheet or multiple sheets of thesame or different materials that have been bonded or otherwise adheredor joined together.

The process continues with the optional formation of top and bottom seedlayers 302 and 304 on the sheet or foil 300 as shown in the cut sideview of FIG. 25B. The two seed layers may be formed at the same time ofthe same material (e.g. via a dual sided sputter using two similarsputtering sources), at the same time with different materials (e.g. viaa dual sided sputtering operation using two different sputteringsources), or at different times with different materials (e.g. via twoseparate sputtering operations). In some variations of this embodimentthe formation of a seed layer may not be necessary. For example, thematerial of the sheet or foil (which may be termed a substrate) mayalready be conductive and may be capable of receiving deposition of anelectrodeposited material. Alternatively, material to be deposited onthe substrate in a next step may be deposited in such a manner that theinitial conductivity of the surface of the substrate is not necessary(e.g. when deposition is to occur by extrusion, sputtering, electrolessdeposition, dumping and spreading of material, or the like). In somevariations of this embodiment, prior to deposition of seed layermaterial, the substrate may receive an adhesion promotion material (e.g.titanium, chromium, tungsten, or a combination of two or more of thesematerials) which may be deposited to any effective thickness (e.g. 0.1nm to 100 nm or more). Seed layers may take a variety of forms and mayor may not be the same material as a subsequent material to bedeposited. Seed layers may include for example copper, gold, silver,nickel, a nickel alloy (e.g. of cobalt or phosphor), palladium,platinum, or a combination of these with each other or with othermaterials. Seed layers may be deposited to any effective thickness (e.g.from 100 nm to 1 um or more).

The process continues with the deposition of a first layer, or group oflayers, of a first top structural material (STRMAT1T) 306 on the topexposed surface and a first bottom structural material (STRMAT1B) 308 onthe lower exposed surface as seen in FIG. 25C which may then beoptionally planarized to set a smooth upper surface 310 and smoothedlower surface 312 as seen in FIG. 25D. In variations of this approach,material 306 or 308 may be deposited in a first operation and planarizedand thereafter the other material may be deposited and planarized. Priorto any optional planarization operations the opposite side of thematerial stack may be temporarily mounted to a substrate (e.g. via avacuum chuck, via a low melting point metal, or meltable polymer). Invariations where multiple depositions of STRMAT1T or STRMAT1B are made,multiple planarization operations or partial planarizations may be usedsuch that successive depositions of STRMAT1T or STRMAT1B are formed on arelatively smooth surface. The deposition of STRMAT1T or STRMAT1B mayoccur in a variety of different ways such as, for example, viaelectroplating, electroless plating, electrophoretic deposition,extrusion, ink jetting, pouring, and the like. In some variationsreverse plating may be used to smooth electrodeposited materials. Theoptional planarization steps leading to the state of the process shownin FIG. 25D may be performed in a variety of different ways depending onthe material being used, the surface finish desired, the amount of workhardening that is desired or that can be tolerated, and the like.Examples of STRMAT1T and STRMAT1B include nickel, nickel cobalt, copper,nickel phosphor, palladium, rhodium, gold, silver, platinum, berylliumcopper, various alloys of these materials with each other or with othermaterials, and the like. Net thickness of the first layer or group oflayers depends on the needs of a given application but can range from 2um or less to 100 ums or more (e.g. 5-40 ums). In some implementations,both STRMAT1T and STRMAT1B may be the same material and may be depositedwith or be made to have approximately the same thickness while in otherimplementations they may be different materials and/or have differentthicknesses. In some embodiments, the sheet or foil may be suspendedfrom its edges while depositions are made from both sides.

FIG. 25E and FIG. 25F are analogous to FIG. 25C and FIG. 25D,respectively, with the exception that they show the state of the processafter deposition of one or more layers of a second top structuralmaterial (STRMAT2T) 314 and a second bottom structural material(STRMAT2B) 316 and optional planarization to achieve surfaces 318 and320. Materials deposited, deposition methods, net thickness, andplanarization methods may be similar to that noted for STRMAT1T andSTRMAT1B.

FIG. 25G and FIG. 25H are analogous to FIGS. 25C-25F with the exceptionthat they show the state of the process after deposition of one or morelayers of a capping sacrificial material (CAPMAT) 322 and optionalplanarization to achieve surface 326 and after deposition of one or morelayers of a bridging sacrificial material (BRGMAT) 324 and optionalplanarization to achieve surface 328. In some variations of this groupof embodiments, a post deposition planarization of CAPMAT and/or BRGMATmay not be required. During subsequent laser cutting or machining it maybe possible to completely cut through the sacrificial bridging materialbut in some preferred implementations, the sacrificial bridging materialwould be thick enough and the laser cutting depth controlledsufficiently such that cutting would reach the sacrificial bridgingmaterial but not extend completely through it (i.e. assuming thatcutting occurs from above, cutting would extend to or below the topsurface of the bridging sacrificial material but terminate above itsbottom surface). The planarization of the CAPMAT and/or BRGMAT may takea variety of different forms. For example, it may be performed by singlestage lapping, multi-stage lapping, CMP, fly cutting, or the like. Netthickness of deposited sacrificial material may range from less than 50um to 300 um or more. Various CAPMATs and BRGMATs may be used dependingon the type of STRMATs used with the requirement that the CAPMAT andBRGMAT be separable from the STRMAT or STRMATs by chemical means (e.g.chemical or electrochemical etching) or physical means (e.g. melting)without causing significant damage to the STRMAT(s) or potentiallydelicate structures formed from the STRMAT(s). In some alternativeembodiments, the CAPMAT and BRGMAT may be dielectrics and may be removedby other means such as plasma etching. Examples of such SACMATs includemetals such as copper, zinc, tin, and iron; alloys of such metals orsuch metals with other metals; polymers; silicon; waxes; and the like.In some embodiments, the CAPMAT and BRGMAT may be formed from the samesacrificial material while in other implementations the materials may bedifferent, they may have similar thicknesses or different thicknesses.In some embodiments it may be more preferable to have thinner CAPMATthan BRGMAT as a thinner CAPMAT may be cut through more quickly while athicker BRGMAT provides more process latitude in ensuring that it isreached by laser cutting but not completely cut through.

FIG. 25I provides a cut side view of the state of the process after thecomposite structure of deposited layers and the sheet or film have beentemporarily bonded to a substrate 330 via a bonding material 329. Suchbonding may provide more stable positioning of the layer stack whilelaser cutting occurs as will be described below in association with FIG.25J. The bonding material may take a variety of forms including, forexample, CRYSTALBOND, WAFERGRIP, WAFER-Mount, wax bonding, double sidedadhesive tape, a heat sensitive adhesive, a pressure sensitive adhesive,a low melting point metal, or the like. Materials for the substrateinclude but are not limited to silicon, silica, alumina, various metals,ceramics, polymers, and the like. In some variations of this embodiment,bonding may occur without use of intermediate material 329 (e.g. whenthe substrate takes the form of a vacuum chuck or magnetic chuck in theevent that one or more of the sheet or deposited materials aremagnetic). In some variations of this embodiment, the bonding of thelayer stack to a substrate may be eliminated in favor of holding thelayer stack around its edges and laser cutting the parts from the sheetwhile being held in a suspended state.

FIG. 25J provides both a perspective view and a cut side view of thestate of the process after laser cutting/machining defines theperimeters 332, 334, 336, and 338 of a plurality of pin-like structures(e.g. probe structures) by cutting completely through the CAPMAT 322,STRMAT2T 314, STRMAT1T 306, the upper seed layer 302, the sheet or foil300, the lower seed layer 304, STRMAT1B 308, and STRMAT2B 316 andcutting partially into BRGMAT 324 while not cutting into the bondingmaterial 329 or substrate 330. As can be seen in the cut side view(lower part of the FIG.), perimeter 332 of one structure is defined bycuts 332-1, perimeter 334 of another structure is defined by cuts 334-1,perimeter 336 of another structure is defined by cuts 336-1, andperimeter 338 is defined by cuts 338-1. In variations of this step, thecutting may extend all the way through the BRGMAT 324 and even into thesubstrate 330. In other variations such extended cutting may occur inonly some lateral regions. In still other variations, cutting may notextend completely through each STRMAT along all lateral portions of theperimeter of each structure so that tethers of STRMAT remain which maybe removed later.

FIG. 25K provides both a top view and a sliced side view of the state ofthe process after separating the layer stack from the substrate andbonding material. Where four parts are outlined by boundaries such as332 and 334 are defined by cut lines such as 336-1 (corresponding toboundary 336) can be seen surrounded by CAPMAT 322, BRGMAT 324, andintervening structural material stacks 333. In some variations of theprocess of this embodiment prior to the removal of the substrate orafter the removal of the substrate, the capping material may be removedin whole or in a selective manner. The removal of the CAPMAT may alsoresult in some removal of the BRGMAT as it may be accessed through thecut lines (assuming they have not been backfilled with some secondarysacrificial material like a wax, polymer, different metal, or the like(which may occur in some embodiment variations). The removal of all orpart of the CAPMAT may allow access to some structural material regionsto which an optional tethering material may be attached. Tether elements(not shown) may take a variety of forms and may be used to hold groupsof parts such as 332, 334, 336, and 338 together. In some variations twotethers may be used per part, one tether may be used per part, more thantwo tethers may be used per part, or different numbers of tethers may beused for different parts. Tethering elements may be attached to material314 at selected locations and they may be formed from selectivelydispensed liquid polymer that can be made to solidify, patterned andbonded strips of a sheet material, patterned photoresist, selectivelydeposited metal, or the like. The tethering material may remain on theupper surface of material 314 or it may extend into any gaps that existaround part perimeters or around widened access regions. Tetheringmaterial might be used for a variety of regions and would generally(though not necessarily) be removed prior to putting individual parts touse. In different implementations, for example, tethering may used tomake part handling easier, tethering may be used to ensure thatdifferent types of structures formed on a single substrate do not becomemixed after release from bridging SACMAT, tethering structures may beused to provide for distinct handling of “good” vs. “bad” structures,and the like. In some alternative embodiments tethering structures maybe formed within openings defined by a masking material or selectedopenings formed in a CAPMAT material or other applied SACMAT such thatonly structures and not intervening material (e.g. material locatedbetween adjacent structures) are contacted by the tethers, in such casesonly “good” structures or other selected structures may be contacted bythe tethers, only “bad” structures or “bad” structures in combinationwith intervening material are contacted by tethers, or the like. In someembodiment variations, cut lines may be filled with a material (e.g. waxthat can be readily removed later) and thereafter tethering materialapplied.

FIG. 25L provides both a top view and a cut side view of the state ofthe process after separating the individual parts from the sacrificialmaterial and from any surrounding intermediate structural materialswherein four separate parts 332, 334, 336, and 338 can be seen.

In some embodiment variations various forms of inspection or testing maybe used during or after formation of one or more of the depositedlayers, after planarization of the deposited layer or layers, afterlaser machining, after CAPMAT removal, or the like to identify “good”parts (i.e. or parts that seem to have been successfully formed), “bad”parts, or suspected “bad” parts (i.e. parts that were not successfullyformed or believed to have not been successfully formed), good partregions or bad part regions (i.e. lateral regions on a substrate whereeither no known failure has occurred or where a failure has occurred oris likely to have occurred), or simply bad depositions or planarizationsof material have occurred.

For example, in some embodiments, hardness testing of deposited materialmay occur. In some embodiments, visual inspections may be used todetermine whether deposited material or planarized material has theright look. In some embodiments thickness measurements of depositedmaterials may be made relative to measurement pads or contact padslocated on the substrate (e.g. formed by removing seed layer materialfrom one or more specific locations or by depositing a dielectricmaterial on the substrate such that electrodeposition of futurematerials is inhibited) or on a previously formed layer. In someembodiments, automatic or manual inspection of cut regions may be usedto distinguish “good” parts from “bad” parts. Automatic methods may useimage comparisons and automatic flagging of regions that meet definedcriteria. In some embodiments, some form of adhesion testing may beperformed to confirm that adequate interlayer bonding has been achieved.Adhesion testing may take different forms such as use of vacuum force,or temporary bonding of an extra material, and applying a peeling force,a tensional force, or a shear force in an attempt to pull layers orsmall layer regions apart, in some embodiments a laser or selectiveetching may be used on some or all layers to define relatively smallshear pad testing regions whereby an opening around a desired area ismade such that a lateral shearing tool may be inserted against one ormore regions to be tested and the force of separation determined with orwithout a follow up visual inspection. Any small gaps formed in a givenlayer by such shear pad testing may be filled in during formation of asubsequent layer, test pad locations on a subsequent layer shifted asnecessary, and testing areas appropriately noted for proper subsequenthandling. In other embodiments other forms of testing or inspection maybe used. Lateral position locations and laser cutting or machining pathsmay be defined based on alignment marks included within contact padregions or included elsewhere on the substrate or on a previously formedlayer. When a “bad” part, region, or layer is detected, various actionsmay be taken depending on the severity of the problem. In an extremecase, a build may be completely scrapped. In a somewhat less extremecase, one or more deposited layers of material may be removed (e.g. viaplanarization) and then reformed. In cases where a layer or multiplelayers have one or more regions that are unacceptable, the acceptable orunacceptable regions may be tagged, or the net acceptable or netunacceptable regions may be tagged (e.g. by taking the Boolean union ofthe unacceptable or acceptable regions from multiple layers) and theinformation used in a follow up step to modify part formation, partseparation methods, rework decisions, scrap decisions, or the like.

Tracking of bad regions or good regions may be done in a manual,semiautomatic or fully automatic manner. In a semiautomatic trackingmethod, a user may make a bad area observation while viewing through amicroscope and a button may be pressed or an outline drawn which isautomatically captured and added to a bad region list. For example, ifit is determined that layers as deposited and planarized were generallygood but that some bad regions existed in a given lateral region on oneof more of those layers, laser cutting or machining may be eliminatedfrom the bad region or regions such that machining or cutting time, andthus overall formation time, is reduced. The area of “bad” regions onany given layer may not be problematic but as layers are added or thepresent layer considered in light of “bad” regions on one or morepreviously formed layers, the effective lateral area of bad regions mayincrease beyond a tolerable level and thus one more layers may need tobe removed and reformed, or otherwise reworked, so that the processingof the individual wafer or substrate may continue while targeting anacceptable yield at the end of the formation process.

In some embodiment variations, after laser cutting and any desiredinspections or tests are performed, but before release from bridgingmaterial, the structures may be bonded to a temporary substrate (e.g.via the top surface of the last formed layer), separation from theoriginal substrate made to occur, and inspection or testing of thebackside materials can be performed, where after additional informationabout “good” and “bad” parts may be obtained and used to modifysubsequent processing or handling steps.

The inspection and testing steps and processes noted above, orappropriate variations, may be applied to the formation of structuresaccording to the other embodiments of the invention.

In one particular implementation of this embodiment, the sheet or foilmay be tungsten, the seed layer on either side may be gold over TiW, thefirst top and bottom STRMAT may be gold, the second top and bottomSTRMATs may be rhodium, while the BRGMAT and CAPMAT may be copper.

In alternatives to the various embodiments set forth herein above, suchas the process of FIGS. 25A-25L and its alternatives, the sheet materialmay be bonded to a first substrate (e.g. via a releasable material)prior to depositing materials thereon and one or more single material ormulti-material layers may be formed on the sheet or foil material andthereafter the partially formed structure can be mounted to a secondsubstrate (e.g. to the last deposited layer) and the first substrateremoved. Thereafter, one or more additional layers each of a singlematerial or of multi-materials may be formed on the backside of thesheet or foil material. On the last layer formed before attaching thepartially formed structure to the second substrate, the last layer mayreceive a one or more sacrificial materials (e.g. a bridging sacrificialmaterial or BRGMAT) which may be deposited with a desired thickness orbe planarized to achieve a desired thickness. After forming the lastlayer of single material or of multi-materials on the backside or thesheet or foil, the last layer may receive a one or more sacrificialmaterials (e.g. a capping material or CAPMAT) which may be depositedwith a desired thickness or be planarized to achieve a desiredthickness. After depositing of the BRGMAT or CAPMAT laser machining maybe performed to pattern the sheet or foil material along with thedeposited structural materials. In other alternative embodimentsrequired laser machining can occur at various intermediate points in theprocess without use of a protective capping material or after depositionof a protective capping material. In other embodiments, use of either acapping material or a bridging material may be eliminated from theprocess.

Alternative Embodiment Involving Staged Laser Machining

FIG. 26 provides a schematic top view of a plurality of parts to beprocessed via staged laser machining such that each part is formed froma plurality of laser exposures some having spatially coincident scansand others having offset lateral scanning positions whereby some partsare machined in series relative to the other parts or groups of parts orin parallel with the other parts or groups of parts or in combination.Set 1 illustrates “m” groups of parts with each group containing “n”parts which are located in a selected lateral region of material to beprocessed. The material to be processed may include a single structuralmaterial in the form of one or more overlaying and bonded sheets orsheet material in combination with deposited material. Depositedmaterial may be only a structural material or a combination ofstructural material and sacrificial material and may be formed in one ormore overlying and adhered layers. Sets 2 to “N” are similar to Set 1but occupy different lateral regions of the material. Laser machiningcan occur set by set moving from one set to an adjacent set or movingfrom one set to any other set. Laser machining can occur within a seteither part-by-part, group-by-group, or part-within-one-group topart-within-another-group. For example scanning may take the form ofcompleting one group before moving to a next group; completing firstparts within each group before moving on to second parts, etc.; orcompleting one pass of one scan position or of multiple scan positionfor one part prior to moving to a next part within the group). Apreferred machining pattern around each part will include multiplespatially coincident exposures along each of two or more offset scanningpaths wherein at least two of the offset scanning paths are subjected todifferent amounts of laser energy when the summed exposure from eachpass along each path is totaled. The different amounts of energy mayresult from a different number of passes occurring along a givenexposure path wherein each exposure pass along each path provides thesame amount of energy per unit/area. Alternatively, the different amountof energy may be achieved by changing the scanning speed, the pulserate, or any of a variety of other laser scanning variables known tothose of skill in the art.

Variations of this embodiment may achieve differential cutting depthwith distance from a part boundary line by means other than that notedabove. An alternative preferred machining pattern around each part mayinclude multiple spatially separated exposure paths, with or without anycoincident multiple exposures along each path (i.e. exposures made withthe center of the beam tracing the same path), but where differentlateral regions receive less energy as distance from a desired partboundary increases due to a changing (e.g. increasing) of the spatialseparation (i.e. distance) between the centerline of each exposure path,different power levels in each pulse of a pulsed laser beam, differentpulse rates, different laser beam profiles, different scanning speeds,different temporal pulse widths (e.g. shorter pulse periods may lead tohigh ablation rates with less material heating), different wavelengths,or any of a variety of other laser scanning variables known to those ofskill in the art. In still other alternatives the order of exposure maybe varied by making successive exposures move away from a part boundary,move toward a part boundary, move in a series of progressive passestoward or away from a part boundary as will be exemplified below.

FIG. 27 provides a schematic top view of three parts 1201-1 (part 1),1201-2 (part 2), and 1201-n (part n) to be processed via staged lasermachining involving three offset paths 1211, 1221, and 1231 per part anddifferent exposure levels along each path due to use of a differentnumber of passes and wherein the scanning of each offset path occurs vialooped exposure patterns. In an example implementation, the first path1211 may receive “x” exposures, while the second 1221 receives “y”exposures, and third 1231 receives “z” exposures with x>y>z. Forexample, each path may be exposed one time, in turn and then repeatingthe exposure pattern until all passes are completed. If for example 60total 1211 passes are to occur, 30 type 1221 passes are to occur, 10type 1231 passes are to occur, the exposure pattern might be 1211 then1221 then 1231, repeated 9 times, followed 1211 then 1221, repeated 19times, followed by 30 exposures along path 1211. Of course, other passnumber may be used along with path offset amounts which may range fromless than 0.1 times the beam diameter up to 0.5, or more, of the beamdiameter.

Variations of the example of FIG. 27 may include reversing the order ofexposure where, exposure of paths is from 3 to 2 to 1. In othervariations, a fourth or higher path may be used. In still othervariations, only two paths may be used. In still other variations, thescanning direction along each path may be the opposite of that shown,may vary from exposure to exposure along each path, or may vary frompath to path. In some variations a substrate may be rotated related tobeam so that beam scanning directions and beam shape effects areaveraged out to give move uniform sidewall performance on all sides of apart that is being machined.

FIGS. 28A-28C provide various schematic top views of sample parts to beprocessed via staged laser machining that involve different non-loopbased exposure methods. FIG. 28A illustrates that a given part need notbe exposed in a loop pattern but may be exposed in a way that provides anet loop exposure but not via a continued loop. For example the closestpath may be exposed first along path 1311-1 then 1311-3, then 1311-2,and finally 1311-4. The middle path may take a similar or differentorder of exposure as may the outer most path. In some variations thescanning direction along the different paths may vary from exposure toexposure. FIG. 28B shows an alternative exposure pattern for the firstpath along each of three parts wherein the left sides of each of thethree parts are exposed first (i.e. paths 1, 2, then 3) and then theright side of each part is exposed (i.e. paths 4, 5, and 6). Of coursein alternatives, other exposure orders may be used. FIG. 28C illustratesthe use of crop dusting or sky writing type methods to cause a scannedbeam to trace a desired exposure path at relative constant speed (e.g.to provide more consistent exposure and cutting depth) along its lengthwith the beam being blocked (e.g. by an acousto-optic modulator or thelike) at the end of the path and the beam being redirected to a desiredturn on point while traveling in a desired scanning direction. Once theturn on point is reached, the beam is allowed to again reach thematerial to be machined.

The staged exposure methods may aid in formation of improved sidewallsby lowering the amount recast material, lowering the occurrence ofregions of excess material removal, lowering sidewall taper, and/orenhancing smoothness. The staged exposure method may aid in the cuttingmulti-material stacks as described above. The method may incorporate theuse of inert atmospheres (e.g. argon, helium, nitrogen, etc.), reducingatmospheres (e.g. hydrogen gas), clean dry air. In some implementationsthe atmosphere may be flowed over the part surface at a desired rate ina direction that is independent of or dependent on the laser cuttingdirection. In some embodiments, the laser beam may be scanned over afixed target, the target may be scanned under a fixed laser beam, orboth may be rotated or translated. In some embodiments, the target (e.g.material to be cut) may be rotated under the laser beam betweensuccessive scans, or groups of scans, so that the side of the beam doingmost if not all of the cutting on critical sides, or even all sides, ofa part remains substantially the same. In some variations, the partsbeing cut may be actively cooled or heated to achieve more uniformcutting results. In some embodiments the laser beam may take a Gaussianconfiguration while in others it may take a donut, a top hat, or otherconfiguration. In some embodiments, the laser beam may have pulse widthsin the nano-second range or longer, pico-second range, or even thefempto-second range or shorter. Depending on the part features to beformed the beam diameter at the surface to be cut may be in thesubmicron range to tens of microns or even larger.

During the multiple exposures involved in staged machining one or moreparameters may be monitored, controlled or varied from exposure toexposure to obtain the most desirable results, for example: (1) beamfocus, (2) beam profile, (3) pulse train temporal spacing, (4) pulsetrain spatial positioning, (5) pulse energy, (6) wavelength, (7) averagepower; (8) cutting speed, (9) number of passes, (10) timing betweensuccessive overlapping (coincident or non-coincident) passes, (11)material based modifications, (10) thickness of materials to be cut,(11) thickness of capping or bridging materials, (12) order ofexposures, (13) material temperature, and (14) atmosphere, material,pressure, and/or flow.

FURTHER COMMENTS AND CONCLUSIONS

While various specific embodiments and some variations have been setforth above, numerous other variations are possible. Some suchvariations may involve the addition of some steps or operations from oneembodiment into another embodiment or the replacement of steps in oneembodiment by steps from a different embodiment. In some embodimentvariations and implementations structural materials may beelectrodepositable materials such as nickel, nickel-cobalt, nickelmanganese, silver, rhodium, copper, tin, and palladium while in otherembodiments other metals, semiconductor materials, or dielectrics may beused which may or may not be electrodepositable. In some embodimentssacrificial material may include one or more of metals, such as copperor tin, iron, or various dielectrics. In some embodiments, materialdeposition may occur by one or more of electroplating, electrolessplating, physical vapor deposition, chemical vapor deposition,spreading, spraying, ink jetting, extruding, fling coating, and thelike. In some embodiments additional steps may be used to provideenhanced or improved part formation such as for example, cleaning steps,surface activation steps, alloying steps, diffusion bonding steps, heattreating steps, process tracking steps, temperature, or atmospherecontrol steps, alignment or fiducially marking steps, and the like. Insome embodiments, especially those involving dielectrics, hard to plateon metals or groups of build materials with incompatibility issues,individual multi-material layers may be formed on barrier layers,adhesion layers and/or seed layers or layer portions. In someembodiments, different layers may have different thickness, more thantwo structural materials may be deposited on any given layer or ondifferent layers and/or more than one sacrificial material may be usedon any given layer or on different layers. In some embodiments, trackingof failed parts may occur manually, or automatically (e.g. bycomputer/program controlled inspection/test hardware, optics, and/oranalysis or comparison methods). For example, parts on a wafer may beexamined under a manual or automatic control of a computer programmingbased on an encoder (X and Y) tracked microscope reticle and when badparts are identified, a position readout may be read and manually loggedor alternatively, a button may be pressed or other command may be issuedthat causes the current microscope X & Y position to be automaticallyrecorded as part of a list of bad structures or part positions.

In some embodiments, the processes set forth herein may be implementedvia multiple independent machines (some or all of which may be manuallyoperated or some or all of which may be computer controlled by programsoperating on user supplied data and/or information generated by othersystem components). In some implementations a single multifunctioncomputer controlled apparatus may be used.

The patent applications and patents set forth below are herebyincorporated by reference herein as if set forth in full. The teachingsin these incorporated applications can be combined with the teachings ofthe instant application in many ways: For example, enhanced methods ofproducing structures may be derived from combinations of teachings,enhanced structures may be obtainable, enhanced apparatus may bederived, and the like.

U.S. patent application No., Filing Date U.S. application publicationNo., Pub Date U.S. Pat. No., Pub Date Inventor, Title 09/493,496 - Jan.28, 2000 Cohen, “Method For Electrochemical — Fabrication” 6,790,377 -Sep. 14, 2004 10/271,574 - Oct. 15, 2002 Cohen, “Methods of andApparatus for 2003-0127336 - Jul. 10, 2003 Making High Aspect Ratio U.S.Pat. No. 7,288,178 - Microelectromechanical Structures” Oct. 30, 200710/387,958 - Mar. 13, 2003 Cohen, “Electrochemical Fabrication2003-022168 - Dec. 4, 2003 Method and Application for Producing —Three-Dimensional Structures Having Improved Surface Finish”10/434,103 - May 7, 2004 Cohen, “Electrochemically Fabricated2004-0020782 - Feb. 5, 2004 Hermetically Sealed Microstructures7,160,429 - Jan. 9, 2007 and Methods of and Apparatus for Producing SuchStructures” 10/434,294 - May 7, 2003 Zhang, “Electrochemical Fabrication2004-0065550 - Apr. 8, 2004 Methods With Enhanced Post — DepositionProcessing” 10/434,295 - May 7, 2003 Cohen, “Method of and Apparatus for2004-0004001 - Jan. 8, 2004 Forming Three-Dimensional Structures —Integral With Semiconductor Based Circuitry” 10/607,931 - Jun. 27, 2003Brown, “Miniature RF and Microwave 2004-0140862 - Jul. 22, 2004Components and Methods for Fabricating 7,239,219 - Jul. 3,2007 SuchComponents” 10/697,597 - Dec. 20, 2002 Lockard, “EFAB Methods andApparatus 2004-0146650 - Jul. 29, 2004 Including Spray Metal or PowderCoating — Processes” 10/830,262 - Apr. 21, 2004 Cohen, “Methods ofReducing Interlayer 2004-0251142 - Dec. 16, 2004 Discontinuities inElectrochemically 7,198,704 - Apr. 3,2007 Fabricated Three-DimensionalStructures” 10/841,006 - May 7, 2004 Thompson, “Electrochemically2005-0067292 - May 31, 2005 Fabricated Structures Having Dielectric orActive Bases and Methods of and Apparatus for Producing Such Structures”10/841,100 - May 7, 2004 Cohen, “Electrochemical Fabrication2005-0032362 - Feb. 10, 2005 Methods Including Use of Surface7,109,118 - Sep. 19, 2006 Treatments to Reduce Overplating and/ orPlanarization During Formation of Multi-layer Three-DimensionalStructures” 10/841,347 - May 7, 2004 Cohen, “Multi-step Release Methodfor 2005-0072681 - Apr. 7, 2005 Electrochemically Fabricated Structures”— 10/949,744 - Sep. 24, 2004 Lockard, “Three-Dimensional Structures2005-0126916 - Jun. 16, 2005 Having Feature Sizes Smaller Than a7,498,714 - Mar. 3, 2009 Minimum Feature Size and Methods forFabricating 10/995,609 - Nov. 22, 2004 Cohen, “ElectrochemicalFabrication 2005-0202660 - Sep. 15, 2005 Process Including ProcessMonitoring, — Making Corrective Action Decisions, and Taking AppropriateActions” 11/028,957 - Jan. 3, 2005 Cohen, “Electrochemical Fabrication2005-0202667 - Sep. 15, 2005 Methods Incorporating Dielectric —Materials and/or Using Dielectric Substrates” 11/029,218 - Jan. 3, 2005Cohen, “Electrochemical Fabrication 2005-0199583 - Sep. 15, 2005 MethodsIncorporating Dielectric 7,524,427 - Apr. 28, 2009 Materials and/orUsing Dielectric Substrates” 11/029,220 - Jan. 3, 2005 Cohen, “Methodand Apparatus for 2005-014846 - Jun. 30, 2005 Maintaining Parallelism ofLayers and/or 7,271,888 - Sep. 18, 2007 Achieving Desired Thicknesses ofLayers During the Electrochemical Fabrication of Structures”11/139,262 - May 26, 2005 Lockard, et al., “Methods for 2006-0011486 -Jan. 19, 2006 Electrochemically Fabricating Structures 7,501,328 - Mar.10, 2009 Using Adhered Masks, Incorporating Dielectric Sheets, and/orSeed Layers that are Partially Removed Via Planarization” 11/506,586 -Aug. 8, 2006 Cohen, “Mesoscale and Microscale 2007-0039828 - Feb. 22,2007 Device Fabrication Methods Using Split 7,611,616 - Nov. 3, 2009Structures and Alignment Elements” 11/733,195 - Apr. 9, 2007 Kumar,“Methods of Forming Three- 2008-0050524 - Feb. 28, 2008 DimensionalStructures Having Reduced Stress and/or Curvature” 12/345,624 - Dec. 29,2008 Cohen, “Electrochemical Fabrication — Method Including ElasticJoining of 8,070,931 - Dec. 6, 2011 Structures” 12/506,547 - Jul. 21,2009 Smalley, “Method of Forming Electrically 2010-0051466 - Mar. 4,2010 Isolated Structures Using Thin Dielectric — Coatings” 12/906.970 -Oct. 18, 2010 Wu, “Multi-Layer, Multi-Material 2011-0132767 - Jun. 11,2009 Fabrication Methods for Producing Micro- — Scale andMillimeter-Scale Devices with Enhanced Electrical or MechanicalProperties” 13/021,939 - May 7, 2004 Method of ElectrochemicallyFabricating 2011-015580 - Jun. 30, 2011 Multilayer Structures HavingImproved Interlayer Adhesion

Though various portions of this specification have been provided withheaders, it is not intended that the headers be used to limit theapplication of teachings found in one portion of the specification fromapplying to other portions of the specification. For example, it shouldbe understood that alternatives acknowledged in association with oneembodiment, are intended to apply to all embodiments to the extent thatthe features of the different embodiments make such applicationfunctional and do not otherwise contradict or remove all benefits of theadopted embodiment. Various other embodiments of the present inventionexist. Some of these embodiments may be based on a combination of theteachings herein with various teachings incorporated herein byreference.

It is intended that the aspects of the invention set forth hereinrepresent independent invention descriptions which Applicantcontemplates as full and complete invention descriptions that Applicantbelieves may be set forth as independent claims without need ofimporting additional limitations or elements from other embodiments oraspects set forth herein for interpretation or clarification other whenexplicitly set forth in such independent claims once written. It is alsounderstood that any variations of the aspects set forth herein representindividual and separate features that may be individually added toindependent claims or dependent claims to further define an inventionbeing claimed by those respective dependent claims should they bewritten.

In view of the teachings herein, many further embodiments, alternativesin design and uses of the embodiments of the instant invention will beapparent to those of skill in the art. As such, it is not intended thatthe invention be limited to the particular illustrative embodiments,alternatives, and uses described above but instead that it be solelylimited by the claims presented hereafter.

We claim:
 1. A method of forming a plurality of laterally displacedmicro-scale or millimeter-scale structure, comprising: a) providing atleast one sheet of structural material having a front side and abackside and extending laterally in a plane of the sheet; b) locating abridging sacrificial material directly or indirectly on the backside ofthe at least one sheet of structural material; c) using a laser beam tocut completely through the at least one sheet from the front side to thebackside along cutting paths to define cross-sectional boundaries ofeach of the plurality of laterally displaced structures without cuttingcompletely through the bridging sacrificial material along the cuttingpaths for the plurality of structures, wherein individual structureshave cross-sectional configurations defined by the cross-sectionalboundaries created by cutting using the laser beam; and d) after thedefining of the cross-sectional boundaries of the plurality of laterallydisplaced structures, releasing the laterally displaced structures fromone another, wherein the releasing comprises removing the bridgingsacrificial material.
 2. The method of claim 1 wherein a sacrificialcapping material is located directly or indirectly on the opposite sideof the at least one sheet structural material relative to the bridgingsacrificial material and wherein the laser beam cuts through the cappingmaterial as well as the at least one sheet.
 3. The method of claim 2wherein the structural material of the sheet comprises a metal, thebridging sacrificial material comprises a metal, and the cappingsacrificial material comprises a metal.
 4. The method of claim 2 whereinthe bridging sacrificial material is deposited directly or indirectlyonto the at least one sheet of structural material by electroplating andthe capping sacrificial material is deposited directly or indirectlyonto the at least one sheet of structural material by electroplating. 5.The method of claim 1 wherein the bridging sacrificial material isattached directly or indirectly to a base which comprises a frame towhich the bridging sacrificial material is attached.
 6. The method ofclaim 5 wherein the attachment to the base comprises a method selectedfrom the group consisting of (a) locating a solidifiable polymer betweenthe base and the bridging sacrificial material and then solidifying thepolymer, or (b) electroplating a sacrificial material through openingsin the base onto the bridging sacrificial material that is being pressedagainst the base.
 7. The method of claim 1 wherein the plurality ofstructures are selected from the group consisting of (a) a plurality ofcompliant pins, (b) a plurality of probes for use in a probe card fortesting integrated circuits, (c) a plurality of electrical springcontactors, and (d) a plurality of multi-component devices.
 8. Themethod of claim 1 wherein cutting by the laser beam occurs by a methodselected from the group consisting of: (a) using a single pass over eachlocation to be cut that cuts completely through the sheet material, (b)using multiple passes over to cause cutting completely through the sheetmaterial while each of at least two passes traces a common cutting patharound a perimeter of each of the plurality of structures, and (c) usingmultiple passes over each location to be cut while at least two passestrace offset cutting paths when cutting the structural material around aperimeter of each of the plurality of structures.
 9. The method of claim1 wherein the direct or indirect locating of the bridging sacrificialmaterial on the sheet of structural material comprises indirect locatingof at least one intermediate material between the bridging sacrificialmaterial and the sheet of structural material wherein the at least onematerial is selected from the group consisting of (a) one singlematerial layer, (b) a plurality of single material layers, (c) a singlemulti-material layer, (d) a plurality of multi-material layers, and (e)a combination of at least one multi-material layer and at least onesingle material layer.
 10. The method of claim 2 wherein the direct orindirect locating of the capping sacrificial material on the sheet ofstructural material comprises indirect locating as at least oneintermediate material is positioned between the capping sacrificialmaterial and the sheet of structural material wherein the at least onematerial is selected from the group consisting of (a) one singlematerial layer, (b) a plurality of single material layers, (c) a singlemulti-material layer, (d) a plurality of multi-material layers, and (e)a combination of at least one multi-material layer and at least onesingle material layer.
 11. The method of claim 1 wherein the angle ofincidence of a laser beam onto the sheet material is different whencutting at least two different lateral portions of the sheet material.12. The method of claim 1 wherein the plurality of structures areinspected and wherein at least one step is implemented that is selectedfrom the group consisting of (a) flagging any failed structure forspecial handling; (b) prior to removing the bridging sacrificialmaterial cutting any failed structure into two or more pieces to enablethem to be readily distinguished from structures that did not failinspection; (c) using an additional material attaching any failedstructures to adjacent structural material so that removal of thebridging sacrificial material does not result in separation of thefailed structures from other portions of the sheet of structuralmaterial.
 13. The method of claim 9 wherein at least one planarizationoperation is used to set a boundary level for at least one layer of theat least one intermediate material.
 14. The method of claim 1 whereinthe plurality of structures comprise a plurality of identicalstructures.
 15. The method of claim 1 wherein the plurality ofstructures comprise a plurality of structures with at least two of theplurality having different lateral configurations.
 16. The method ofclaim 1 wherein the at least one sheet material includes at least oneregion that undergoes vertical narrowing by laser ablation prior tocutting out the perimeter region of the at least one structure.
 17. Themethod of claim 1 wherein the at least one sheet material includes atleast one region that undergoes vertical narrowing prior to locating atleast one additional layer of material, wherein the at least one sheetmaterial undergoes laser ablation to form at least one through holeprior to locating at least one additional layer of material.
 18. Themethod of claim 1 wherein during laser cutting the sacrificial bridgingmaterial is cut completely through in only a portion of the locationsalong the cutting path for any given structure being formed such thatthe bridging material still holds the structure to the rest of the sheetmaterial.
 19. The method of claim 1 wherein during laser cutting thesacrificial bridging material is not cut completely through in anylocations.
 20. The method of claim 1 wherein laser cutting of the sheetmaterial or of another structural material occurs from both the top andbottom surfaces.